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WE-TTT Thermal Transfer Tape NEW

Characteristics

  • Customizable in size and shape
  • No MOQ or tooling costs
  • No need for additional mechanical fixing of cooling assemblies
  • Double-sided adhesive surface
  • High mechanical strength
  • Ideal if a thin bond is required

Applications

  • Power semiconductors
  • Graphic processing units
  • Microprocessors
  • Chipsets
  • Memory modules
  • Cooling assemblies

Products

Order Code Data­sheet DownloadsL
(m)
W
(mm)
H
(mm)
κ
(W/(m*K))
Dielectric Strength
(kV/mm)
Adhesive Strength
(N/ cm)
Samples
403012008SPEC
2 files 25 8 0.2 1 4 5.79
403012050SPEC
2 files 25 50 0.2 1 4 5.79
Order Code Data­sheet
403012008SPEC
403012050SPEC
Samples
Order Code Data­sheet DownloadsL
(m)
W
(mm)
H
(mm)
κ
(W/(m*K))
Dielectric Strength
(kV/mm)
Adhesive Strength
(N/ cm)
Samples