IC-Hersteller NXP
IC-Hersteller (96)
- Alle Hersteller
Analog Devices
Infineon Technologies
Maxim Integrated
Microchip
Onsemi
Renesas
ROHM
STMicroelectronics
Texas Instruments
- 3peak incorporated (12)
- Ablic (23)
- Advanced Power (4)
- Allegro Microsystems (83)
- Alpha & Omega Semiconductor (37)
- AnalogySemi (3)
- AnDAPT Inc (130)
- Anpec (13)
- AXElite (2)
- Backward (6)
- Broadcom (47)
- Cambridge GaN Devices (16)
- Chipanalog Micro (10)
- Cologne Chips (1)
- Dialog Semiconductor (11)
- Diodes Incorporated (219)
- Divimath (8)
- Elmos AG (1)
- EPC (98)
- e-Peas Semiconductors (1)
- Eta Solutions Co. Ltd. (9)
- GaN Systems (6)
- Giantec (1)
- Gstek Wuxi (1)
- Helix Semiconductor (7)
- Ikanos (3)
- IKON (1)
- Indie Semiconductor (1)
- Innovision Semiconductor Inc (2)
- Intel (80)
- Inventchip Technology (3)
- ISSI (34)
- JoulWatt (20)
- KDPOF (2)
- Kinetic Technology (9)
- Lattice semiconductor Corporation (8)
- Littelfuse (1)
- M3 Technology (M3Tek) (4)
- Macnica (16)
- MaxLinear (175)
- MikroE (7)
- MindCet (1)
- Monolithic Power Systems (879)
- Navitas Semiconductor Inc (6)
- NewEdge Technologies, Inc. (1)
- Nexperia (2)
- Nisshinbo Micro Device Inc. (10)
- Nordic Semiconductor (1)
- Novosense Micro (1)
- NXP (312)
- O2 Micro International Ltd (10)
- On Bright (7)
- Panasonic (2)
- PN Junction Semiconductor (2)
- Power Integrations (96)
- Pulsiv (18)
- Qorvo (87)
- Realsil SuRealsil(tek) Microelectronics (1)
- Richtek (289)
- Sanken Electric Co., Ltd. (16)
- Sckipio (6)
- Semtech (90)
- SG-Micro (19)
- Silanna Semiconductor (8)
- Silergy Corporation (29)
- Silicon Laboratory Inc. (90)
- Silicontent Technology (56)
- Silvertel (54)
- Skyworks (31)
- Southchip (6)
- Summit Wireless (1)
- Tagore Tech (4)
- Taiwan Semiconductor (1)
- TDK Corporation (1)
- Tempo Semiconductor (1)
- Torex (37)
- Toshiba (25)
- Transphorm (21)
- TransSIP (2)
- Union (21)
- uPI Semiconductor (1)
- Valens Semiconductor (18)
- Wise Integration (1)
- Wolfspeed (5)
- Xilinx (18)
- XL Semiconductor (3)
- XYSemi (62)
NXP LX2160A-RDB-B
Fully qualified to meet NXP quality and reliability requirements. Available for production quantity orders.
Details
| Topologie | Sonstige Topologie |
| IC-Revision | 00 |
Beschreibung
The LX2160A reference design board provides a comprehensive platform that enables design and evaluation of the LX2160A or LX2162A processors. It comes preloaded with a board support package (BSP) based on a standard Linux kernel.Enables network intelligence with the next generation Datapath (DPPA2) which provides differentiated offload and a rich set of IO, including 10GE, 25GE, 40GE, and PCIe Gen3Delivers unprecedented efficiency and new virtualized networksSupports designs in 5G packet processing, network function virtualization, storage controller, white box switching, network interface cards, and mobile edge computingSupports all six LX2 family members (16-core LX2160A and LX2161A; 12-core LX2120A and LX2122A; and 8-core LX2080A and LX2082A)
Eigenschaften
- Processor:
- LX2160A, 16x Arm® Cortex®-A72 CPU, 2.2GHz
- Memory:
- Two DDR4 UDIMM to 3200MT/s
- 32GB total capacity (16GB per UDIMM)
- Flash: 128MB NOR, 128GB eMMC
- Ethernet:
- One 40G Ethernet QSFP+
- Two 25G Ethernet SFP+
- Two RJ45 10G Ethernet
- Two RJ45 1G Ethernet
- Other IO:
- One PCIe Gen3 x8 slot
- One PCIe Gen3 x4 slot
- Four SATA3.0 connectors
- One USB3.0 Type A connector
- One USB3.0 micro-AB connector
Weiterführende Informationen
Artikeldaten
| Artikel Nr. | Datenblatt | Simulation | Downloads | Produktserie | Pins | Gender | Typ | Montageart | Betriebstemperatur | Arbeitsspannung (V (AC)) | C | Tol. C | VR (V (DC)) | Bauform | Q (%) | RISO | Keramiktyp | L (mm) | W (mm) | H (mm) | Fl (mm) | Verpackung | L (µH) | IRP,40K (A) | ISAT (A) | RDC max. (mΩ) | fres (MHz) | Version | LR (nH) | IR (A) | ISAT1 (A) | ISAT,30% (A) | RDC (mΩ) | Material | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 7447714015 | SPEC | 8 Dateien | WE-PD SMT-Speicherdrossel | 2 | – | – | SMT | -40 °C up to +150 °C | – | – | – | – | 1050 | – | – | – | 10 | 10 | 5 | – | – | 1.5 | – | 12.5 | 6.6 | 69 | Performance | – | 10 | – | – | – | – | ||
 | 693061010911 | SPEC | – | 6 Dateien | WR-CRD SD Card Connector Push & Push with Card Detection 9 pins | 9 | Socket | Push & Push | SMT | -25 °C up to +85 °C | 100 | – | – | – | – | – | 1000 MΩ | – | – | – | – | – | Tape and Reel | – | – | – | – | – | – | – | 0.5 | – | – | – | – | |
 | 744308033 | SPEC | 8 Dateien | WE-HCM SMT-Hochstrominduktivität | – | – | – | – | -40 °C up to +125 °C | – | – | – | – | 1070 | – | – | – | 10.1 | 7 | 6.8 | – | – | 0.33 | 54.3 | – | 396 | – | – | 305 | 25 | 27.3 | 32 | 0.37 | MnZn | ||
 | 885012005057 | SPEC | 8 Dateien | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | -55 °C up to +125 °C | – | 22 pF | ±5% | 50 | 0402 | 840 | 10 GΩ | NP0 Klasse I | 1 | 0.5 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – |
| Artikel Nr. | Datenblatt | Simulation | |
|---|---|---|---|
| 7447714015 | SPEC | |
| 693061010911 | SPEC | – |
| 744308033 | SPEC | |
| 885012005057 | SPEC |
| Muster |
|---|
| Artikel Nr. | Datenblatt | Simulation | Downloads | Produktserie | Pins | Gender | Typ | Montageart | Betriebstemperatur | Arbeitsspannung (V (AC)) | C | Tol. C | VR (V (DC)) | Bauform | Q (%) | RISO | Keramiktyp | L (mm) | W (mm) | H (mm) | Fl (mm) | Verpackung | L (µH) | IRP,40K (A) | ISAT (A) | RDC max. (mΩ) | fres (MHz) | Version | LR (nH) | IR (A) | ISAT1 (A) | ISAT,30% (A) | RDC (mΩ) | Material | Muster |
|---|