The production-ready s.mask technology sets new standards in PCB manufacturing. This groundbreaking, inkjet-based additive solder resist process combines sustainability, precision, and innovation to meet the demands of modern electronics.
By combining this novel technology with suitable acrylic lacquers, it is possible to print 3D structures up to 1.5 mm high on the printed circuit board, in addition to the “printed minimal design,” in which the solder resist is applied exclusively to copper surfaces and the substrate remains free.
This will open up completely new design possibilities in the third dimension for developers in the future, in addition to the use of particularly resource-efficient processes.
Design/description: 3D structures highlighted here can serve a variety of purposes. They can be used as graphic elements, such as a brand or company logo or branding. If only frames are printed, these can be used as protective elements or casting frames. Individual bodies can be used, for example, as mechanical structures or as supports and spacers for a wide range of requirements.
Description: Elements highlighted here serve, for example, to protect more delicate elements on the surfaces between them. With minimal structure widths, these fine elements must be protected against damage from heavy mechanical stress, such as during handling (transport at the PCB manufacturer or EMS).
Description: These elements are used to increase the creepage distance between adjacent conductive areas and elements on the surface of the printed circuit board. This means, for example, that the creepage distance can be significantly increased while maintaining the same distance between conductive areas on the surface of the printed circuit board. This requires an increase and thus a lengthening of the distance in the Z-axis using acrylic lacquer.
Furthermore, the additive solder resist application process also makes it possible to selectively increase the coverage at the conductor track edges in certain areas.
Description: With additive printing technology, it is sufficient to print lacquer only on the areas of the design that need to be protected and covered (copper traces and areas). This significantly reduces the amount of solder resist required and greatly improves the CO2 footprint.
Description: The very small drop size allows minimal structures to be printed. The limits were deliberately not quite reached on the hand sample. However, character sizes of 0.4 x 0.63 mm are entirely conceivable.
Description: In these areas, QR and data matrix codes are displayed in various sizes, resolutions, and contrasts (on copper or only on the insulator/prepreg). Special camera systems may be required to read the smallest codes measuring 2 mm x 2 mm.
Description: Different printing strategies during application and pre-curing of the solder resist can give it a glossy or matte appearance.
Description: In conventional curtain coating/spray coating applications, the limits of the design rules relating to clearance around the pad and the minimum residual bridge are not met. However, the requirements of the soldering process can be fulfilled by using digital printing of the solder resist.
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