WP-TGTR REDCUBE PRESS-FIT two-part, ground terminal

Applications

Using the Press-Fit Elements, currents of up to approx. 300A can be transferred to the PCB.

General Information
Operating Temperature	-55 °C up to +150 °C
Material	Brass
Surface	Tin
Execution	Press-Fit

Packaging Properties
Packaging	Bulk

Application Notes

Press-Fit Technology
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Order Code	Datasheet	Downloads	Status	W(mm)	H(mm)	Ø ID(mm)	I_R(A)	Pins	Use with	Design Kit
7461070	9 mm, 3.1 mm, 5.5 mm	Downloads5 files EDA models: Components ZIP ALT Altium_WP-TGTR (rev22b).IntLib \| 138 KB CDS Cadence_WP-TGTR (rev22a).zip \| 705.9 KB EAG Eagle_WP-TGTR (rev22a).lbr \| 38.9 KB KIC KiCad_WP-TGTR (rev26a).zip \| 170.3 KB CAD files ZIP STP 7461070 (rev1).stp \| 160.8 KB Download all 5 files as zip archive ZIP	Status Activei\| Production is active. Expected lifetime: >10 years.	Width9 mm	Height3.1 mm	Inner Diameter5.5 mm	Rated Current160 A	Pins8	Use with 7461073 7461118 7461119 7461120 7461121 7461122	Design Kit 746701
7460211	13 mm, 3.1 mm, 7.3 mm	Downloads5 files EDA models: Components ZIP ALT Altium_WP-TGTR (rev22b).IntLib \| 138 KB CDS Cadence_WP-TGTR (rev22a).zip \| 705.9 KB EAG Eagle_WP-TGTR (rev22a).lbr \| 38.9 KB KIC KiCad_WP-TGTR (rev26a).zip \| 170.3 KB CAD files ZIP STP 7460211 (rev1).stp \| 196.7 KB Download all 5 files as zip archive ZIP	Status Activei\| Production is active. Expected lifetime: >10 years.	Width13 mm	Height3.1 mm	Inner Diameter7.3 mm	Rated Current240 A	Pins10	Use with 7461123 7461124 7461082 7461126 7461127 7461074	Design Kit 746701
7461166	16 mm, 3.1 mm, 9.8 mm	Downloads5 files EDA models: Components ZIP ALT Altium_WP-TGTR (rev22b).IntLib \| 138 KB CDS Cadence_WP-TGTR (rev22a).zip \| 705.9 KB EAG Eagle_WP-TGTR (rev22a).lbr \| 38.9 KB KIC KiCad_WP-TGTR (rev26a).zip \| 170.3 KB CAD files ZIP STP 7461166 (rev1).stp \| 232.4 KB Download all 5 files as zip archive ZIP	Status Activei\| Production is active. Expected lifetime: >10 years.	Width16 mm	Height3.1 mm	Inner Diameter9.8 mm	Rated Current320 A	Pins12	Use with 7461128 7461075 7461129	Design Kit –
7462095	16 mm, 3.1 mm, 10.5 mm	Downloads5 files EDA models: Components ZIP ALT Altium_WP-TGTR (rev22b).IntLib \| 138 KB CDS Cadence_WP-TGTR (rev22a).zip \| 705.9 KB EAG Eagle_WP-TGTR (rev22a).lbr \| 38.9 KB KIC KiCad_WP-TGTR (rev26a).zip \| 170.3 KB CAD files ZIP STP 7462095 (rev1).stp \| 232.4 KB Download all 5 files as zip archive ZIP	Status Activei\| Production is active. Expected lifetime: >10 years.	Width16 mm	Height3.1 mm	Inner Diameter10.5 mm	Rated Current320 A	Pins12	Use with 7462096 7462097 7462098	Design Kit –

REDCUBE Terminals - 4power!

REDCUBE terminals are the most reliable high-power contacts on the PCB level. Low contact resistance guarantees minimum self-heating. Four different designs cover all leading processing technologies and offer a wide range of applications.

Characteristic:

Flexibility in processing and connection technologies
Highest current ratings up to 500 A
Board-to-Board and Wire-to-Board solutions
Extremely low self-heating
Robust mechanical connection

REDCUBE PRESS-FIT

Applications, Performance & Press-Fit Process

Applications

The current rating of REDCUBE PRESS-FIT is impressive. With the same ampacity, REDCUBE PRESS-FIT has the lowest heat development compared to other parts that supply power for PCBs.

High current Wire-to-Board & Board-to-Board
Mounting of copper bars
Angled assembling of cable, PCB and housing
Mounting of IGBT modules

Remarkable Performance

With the lowest Failure-In-Time value, REDCUBE PRESS-FIT is the most reliable technology on PCB. The FIT value is up to 30 times better than that of a SMD solder joint. REDCUBE PRESS-FIT is suitable for two-side mounting and allows very compact design of modules.

Simple & quick processing
No cold solder joints
High process safety
Low self heating
Two-sided mounting of PCBs

PRESS-FIT Process

Pressing the pins into the PCB, a high friction between pin and plated through-hole generates a homogeneous cold-welding between materials. No other technology transfers power up to 500 A at this low heat development.