WE-TTT Thermal Transfer Tape
Characteristics
- Customizable in size and shape
- No MOQ or tooling costs
- No need for additional mechanical fixing of cooling assemblies
- Double-sided adhesive surface
- High mechanical strength
- Ideal if a thin bond is required
- Do you wish an individual offer for WE-TTT? Request now! Request for customized components WE-TTT
Applications
- Power semiconductors
- Graphic processing units
- Microprocessors
- Chipsets
- Memory modules
- Cooling assemblies
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Reset allOrder Code | Datasheet | Downloads | Status | L(m) | W(mm) | H(mm) | κ(W/(m*K)) | Dielectric Strength(kV/mm) | Adhesive Strength(N/ cm) | Samples |
|---|---|---|---|---|---|---|---|---|---|---|
403012008 | SPEC | Status Activei| Production is active. Expected lifetime: >10 years. | Length25 m | Width8 mm | Height0.2 mm | Thermal Conductivity1 W/(m*K) | Dielectric Strength4 kV/mm | Adhesive Strength5.79 N/ cm | ||
403012050 | SPEC | Status Activei| Production is active. Expected lifetime: >10 years. | Length25 m | Width50 mm | Height0.2 mm | Thermal Conductivity1 W/(m*K) | Dielectric Strength4 kV/mm | Adhesive Strength5.79 N/ cm |
