Elastomeric pads are one of the most used thermal management solutions in present-day electronic designs. The pads are engineered from silicone-based or silicone-free materials, due to the mechanical material properties and versatility with regards to thermal performance. Unlike traditional thermal interface materials (TIM) such as pastes and greases, elastomeric pads are soft, compliant, and adaptable. This makes them ideal for applications where there are variations in component heights or irregular surfaces. Their unique properties allow for efficient heat transfer between electronic components and heat sinks or other cooling
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