The miniaturization of components and assembled PCBs remains an ongoing topic and often a challenge. If we look at the packaging form Ball Grid Array (BGA), for example, you can usually unbundle the footprint up to a BGA pitch of 0.8 mm with conventional BASIC technology using plated through holes (PTH). Below that, you need laser-drilled microvias, and at a BGA pitch of 0.4 mm, advanced design requirements are already necessary.
But what do you do at a BGA pitch of 0.35 mm if you cannot or are not allowed to use 25 µm structures?
Learn more in this webinar about

• suitable PCB technologies and design parameters
• solutions while maintaining the need for impedance control
• the reliability of available technologies
• the unbundling of a VFBGA component in a live demonstration

Webinar presentation