Webinar Würth Elektronik PCBs: Miniaturization for industrial electronics, taking cost and reliability aspects into account.

Smaller, more powerful, more adaptable: with High Density Interconnect (HDI) you can manage the balancing act between miniaturisation, costs and reliability. In the miniaturisation of PCBs, microvias in the "via in pad" design play a decisive role in unbundling increasingly dense BGA components.

In this webinar we will show you

• Miniaturisation options for rigid PCBs
• Different via designs
• Design rules for High Density Interconnect
• Layer structures & cost development
• Signal integrity with HDI
• Reliability aspects and heat dissipation with HDI

Webinar presentation