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WE-PCM Thermal Phase Changing Material NEW

Characteristics

  • Customizable in size and shape
  • No MOQ or tooling costs
  • Alternative to thermal pastes and greases
  • Electrically insulating if required
  • Lower thermal resistance than other TIM solutions
  • Easy to handle in manufacturing environments

Applications

  • Power supplies
  • Transistors: FETs, IGBTs
  • SiC and GaN
  • High speed systems: FPGAs, CPUs and GPUs
  • ICs: ADCs, DACs and memory modules

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