USB-C now offers different variants of connectors from USB 2.0 in a type-C housing to type-C for 10 GBit data rate. The housing variants have also become more diverse. From the horizontal hybrid type to vertical variants to the mid-mount type, which is placed in a PCB cutout. All of these types have their own special characteristics, which in many cases must be taken into account in the layout so that problem-free production is possible afterwards.
We would therefore like to shed light on these points and show possibilities for dealing with these issues. Also the PCB itself and its production cannot be left out of the equation, as it has certain limitations that should be taken into account in order to achieve an optimal result. These include layer structure, material properties and reproducible processes.
Trace routing and resulting impedance characteristics are essential to maintain signal integrity. The components used, which can influence the signal and in the worst case lead to disturbed or non-functioning systems, must also be taken into account.
Once all this has been done, the manufacturing process must be controlled in its various steps from paste printing to the soldering and the parameters must be optimized so that the filigree Type C connectors can also be processed for series production.