How can the space in the housing and in the layout on your PCB be optimally used with regard to miniaturisation? We have the solution: By combining HDI technology and rigid-flex, you can alleviate tight spaces. We will show you how, for example, unnecessary vias can be removed and thus space gained through filled holes and clever routing of BGA footprints. With the rigid-flex technology, footprints for connectors can also be saved. We will show you these and other tips in our webinar!
Learn in this webinar
Webinar Recording | German
Webinar Recording | English
Webinar Recording | English