20.09.2020
Webinar Recording
English

Webinar Würth Elektronik PCBs: Reliability Proof by Interconnect Stress Test (IST) Part II-Consolidation

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After the successful introduction webinar, we now delve deeper into the physics and statistics of the Interconnect Stress Test (IST). We will compare the IST with the well-known temperature cycle test (TCT) and demonstrate the possibilities of statistical analysis.

The following topics are discussed in detail in the webinar:

  • Failure modes and their causes
  • Evaluation and presentation of the results of reliability proof
  • Possibilities for optimisation
  • Factors influencing the reliability of PCBs

 

Webinar presentation

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