The presentation examines the market trends pushing the limits of electronic components, focusing on the critical phenomenon of thermal aging in molded inductors. As current density increases and miniaturization drives components to operate at higher temperatures, the risk of thermal aging issues rises.  In todays presentation we will discuss about reasons and consequences of thermal aging in molded inductors, thermal aging detection, effects of thermal aging in applications and finally Wurth Elektronik's product line up designed for the challenges associated with thermal aging.

Presentation: Introduction to thermal aging in molded inductors