Today, nearly every device design must exploit the available space to its fullest regarding electronic functionality and component density. Integrated circuits are driving miniaturization, and with this come major challenges in thermal management. Smaller designs combined with the requirement for very high performance result in many designs overheating.
This support note SN035 analyzes heatsinks as a possible solution for thermal management, specifically for applications such as transistors with TO220 or TO247 packaging (WE-HTO heatsinks) and for applications such as CPUs or DC/DC converters (WE-HIC heatsinks).
Download: SN035
