The constant market demand to increase power density and efficiency, as well as making the power supply electronics smaller, has pushed each element inside the system to its limits. Moreover, greater power requirements and miniaturization expose passive electronic components to higher and higher temperatures, increasing the probability of the thermal aging. This is a representative phenomenon that can be found in molded power inductors even with AEC-Q200 Grade 0 qualification (operating temperature range between - 55 °C to 150 °C). This note will discuss the issues that inductors face when exposed to high temperatures for extended periods of time, with a special focus on molded high current power inductors and the necessity to recognize the effects of thermal aging in the inductor selection.
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Download: ANP128
