10 years together through "cold and warm"

Another assembly that we tested was a central electrical system from 1998 that had been installed in an air conditioning unit. This assembly was also examined thermically by loading it with a constant electric current of 20A while in a fixed position.

In the same test the thermic behavior of an identical component group was examined that had been created using solder technique. The results clearly showed that the component group in press-fit technology was 15 - 20°C cooler than the component group in solder technology even after 10 years of use.

Where the press-fit connection and solder connection were compared, it was approximately 10K, which is a 50% increase in temperature for the solder connection than with the press-fit connection.