IC manufacturers NXP

IC manufacturers (95)

NXP MC33772B | Demoboard RDDRONE-BMS772

Smart Battery Management for Mobile Robotics

Overview

TopologyBattery Management System
Input voltage6-26 V
Output 126 V / 90 A
IC revisionA

Description

The 33772 is a SMARTMOS lithium-ion battery cell controller IC designed for automotive applications, such as hybrid electric (HEV) and electric vehicles (EV) along with industrial applications, such as energy storage systems (ESS) and uninterruptible power supply (UPS) systems. The device performs ADC conversions of the differential cell voltages and current, as well as battery coulomb counting and battery temperature measurements. The information is digitally transmitted through the Serial Peripheral Interface (SPI) or Transformer Isolation (TPL) to a microcontroller for processing.

Features

  • 5.0 V ≤ VPWR ≤ 30 V operation, 40 V transient
  • 3 to 6 cells management
  • 0.8 mV total cell voltage measurement error
  • Isolated 2.0 Mbps differential communication or 4.0 Mbps SPI
  • Addressable on initialization
  • Synchronized cell voltage/current measurement with coulomb count
  • Total stack voltage measurement
  • Seven GPIO/temperature sensor inputs
  • 5.0 V reference supply output with 5 mA capability
  • Automatic over/undervoltage and temperature detection routable to fault pin
  • Integrated sleep mode over/undervoltage and temperature monitoring
  • Onboard 300 mA passive cell balancing with diagnostics
  • Hot plug capable
  • Detection of internal and external faults, as open lines, shorts, and leakages
  • Designed to support ISO 26262 up to ASIL D safety system
  • Fully compatible with the MC33771 for a maximum of 14 cells
  • Qualified in compliance with AEC-Q100

Typical applications

  • Uninterruptible Power Supply (UPS)
  • Automotive: 12 V to high-voltage battery packs, E-bikes, e-scooters, Energy Storage Systems (ESS), Battery junction box

Products

Order Code Data­sheet Simu­lation Downloads Product seriesEmitting ColorλPeak G typ.
(nm)
λDom B typ.
(nm)
λDom G typ.
(nm)
λDom R typ.
(nm)
IV B typ.
(mcd)
IV G typ.
(mcd)
IV R typ.
(mcd)
VF B typ.
(V)
VF G typ.
(V)
VF R typ.
(V)
Chip Technology50% typ.
(°)
CTol. CVR
(V (DC))
SizeOperating TemperatureQ
(%)
DF
(%)
RISOCeramic TypeL
(mm)
W
(mm)
Fl
(mm)
L
(µH)
ISAT
(A)
RDC max.
(mΩ)
fres
(MHz)
MountPinsRowsH
(mm)
GenderTypeIR
(A)
Packaging Samples
885012005057SPEC
8 files WCAP-CSGP MLCCs 50 V(DC)22 pF ±5% 50 0402 -55 °C up to +125 °C 84010 GΩ NP0 Class I 1 0.5 0.25 0.5 7" Tape & Reel
885012205031SPEC
8 files WCAP-CSGP MLCCs 16 V(DC)10 nF ±10% 16 0402 -55 °C up to +125 °C 3.510 GΩ X7R Class II 1 0.5 0.25 0.5 7" Tape & Reel
885012205035SPEC
5 files WCAP-CSGP MLCCs 16 V(DC)47 nF ±10% 16 0402 -55 °C up to +125 °C 510 GΩ X7R Class II 1 0.5 0.25 0.5 7" Tape & Reel
885012205050SPEC
8 files WCAP-CSGP MLCCs 25 V(DC)10 nF ±10% 25 0402 -55 °C up to +125 °C 3.510 GΩ X7R Class II 1 0.5 0.25 0.5 7" Tape & Reel
885012205061SPEC
8 files WCAP-CSGP MLCCs 50 V(DC)1 nF ±10% 50 0402 -55 °C up to +125 °C 2.510 GΩ X7R Class II 1 0.5 0.25 0.5 7" Tape & Reel
885012205063SPEC
8 files WCAP-CSGP MLCCs 50 V(DC)2.2 nF ±10% 50 0402 -55 °C up to +125 °C 2.510 GΩ X7R Class II 1 0.5 0.25 0.5 7" Tape & Reel
885012205065SPEC
8 files WCAP-CSGP MLCCs 50 V(DC)4.7 nF ±10% 50 0402 -55 °C up to +125 °C 2.510 GΩ X7R Class II 1 0.5 0.25 0.5 7" Tape & Reel
885012205067SPEC
8 files WCAP-CSGP MLCCs 50 V(DC)10 nF ±10% 50 0402 -55 °C up to +125 °C 2.510 GΩ X7R Class II 1 0.5 0.25 0.5 7" Tape & Reel
62201021121SPEC
6 files WR-PHD 1.27 mm THT Dual Pin Header -40 °C up to +105 °C500 MΩ 6.35 THT 10 Dual Pin Header Straight 1 Box
74406043101SPEC
8 files WE-LQFS SMT Power Inductor 4828 -40 °C up to +125 °C 4.8 4.8 100 0.37 600 11 SMT 2.8 0.62
155124M173200SPEC
29 files
WL-SFSW SMT Full-color Side View Waterclear Red & Green & Blue 515 465 523 622 140 850 450 3 2.8 2 AlInGaP + InGaN 120 1204 -40 °C up to +85 °C 3.2 1.5 SMT 1 Tape and Reel
Samples
Order Code Data­sheet Simu­lation Downloads Product seriesEmitting ColorλPeak G typ.
(nm)
λDom B typ.
(nm)
λDom G typ.
(nm)
λDom R typ.
(nm)
IV B typ.
(mcd)
IV G typ.
(mcd)
IV R typ.
(mcd)
VF B typ.
(V)
VF G typ.
(V)
VF R typ.
(V)
Chip Technology50% typ.
(°)
CTol. CVR
(V (DC))
SizeOperating TemperatureQ
(%)
DF
(%)
RISOCeramic TypeL
(mm)
W
(mm)
Fl
(mm)
L
(µH)
ISAT
(A)
RDC max.
(mΩ)
fres
(MHz)
MountPinsRowsH
(mm)
GenderTypeIR
(A)
Packaging Samples