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Texas Instruments AMC1306M05DWVR | Demoboard TIDA-01606 Power Card

10kW 3-Phase 3-Level Grid Tie Inverter Reference Design for Solar String Inverter

Details

TopologieSonstige Topologie
IC-RevisionE4

Beschreibung

This verified reference design provides an overview on how to implement a three-level three-phase SiC based DC:AC grid-tie inverter stage.Higher switching frequency of 50KHz reduces the size of magnetics for the filter design and enables higher power density. The use of SiC MOSFETs with switching loss ensures higher DC bus voltages of up to 1000V and lower switching losses with a peak efficiency of 99 percent. This design is configurable to work as a two-level or three-level inverter.The system is controlled by a single C2000 microcontroller (MCU), TMS320F28379D, which generates PWM waveforms for all power electronic switching devices under all operating modes.

Eigenschaften

  • Rated Nominal and Max Input Voltage at 800-V and 1000-V DC
  • Max 10-kW/10-kVA Output Power at 400-V AC 50- or 60-Hz Grid-Tie Connection
  • Operating Power Factor Range From 0.7 Lag to 0.7 Lead
  • High-Voltage (1200-V) SiC MOSFET-Based FullBridge Inverter for Peak Efficiency of 98.5%
  • Compact Output Filter by Switching Inverter at 50 kHz
  • <2% Output Current THD at Full Load
  • Isolated Driver ISO5852S With Reinforced Isolation for Driving High-Voltage SiC MOSFET and UCC5320S for Driving Middle Si IGBT
  • Isolated Current Sensing Using AMC1301 for Load Current Monitoring
  • TMS320F28379D Control Card for Digital Control

Typische Anwendungen

  • Industrial Motor Drives
  • Uninterruptible Power Supplies
  • Photovoltaic Inverters

Weiterführende Informationen

Artikeldaten

Artikel Nr. Daten­blatt Simu­lation Downloads ProduktserieCVR
(V (DC))
dV/dt
(V/µs)
DF @ 1 kHz
(%)
RISOBetriebstemperaturRaster
(mm)
L
(mm)
W
(mm)
H
(mm)
TiTl
(mm)
PinsZ @ 100 MHz
(Ω)
Zmax
(Ω)
Testbedingung ZmaxIR
(mA)
Z @ 1 GHz
(Ω)
TypReihenG
(mm)
GenderVerpackung Muster
890303325008CSSPEC
8 Dateien WCAP-FTBP Folienkondensatoren150 nF 630 200 0.130000 MΩ -40 °C bis zu +105 °C 15 18 7 13 4 Karton
74279228260SPEC
8 Dateien WE-MPSB EMI Multilayer Power Suppression Bead 1.6 0.8 0.8 26 39 515 MHz 6500 33 High Current
61300211121SPEC
6 Dateien WR-PHD 2.54 mm THT Pin Header1000 MΩ 2.54 5.08 2 3000 Gerade Single Pin Header Beutel
74650073RSPEC
6 Dateien WP-THRBU REDCUBE THR with internal through-hole thread 7 3 M3 2.5 4 50000 Tape and Reel
750343811SPEC
4 Dateien Inductor 42 27 42 4 Tray
750343810SPEC
4 Dateien Inductor 67.5 67.5 39.88 4 Tray
Artikel Nr. Daten­blatt Simu­lation
890303325008CSSPEC
74279228260SPEC
61300211121SPEC
74650073RSPEC
750343811SPEC
750343810SPEC
Muster
Artikel Nr. Daten­blatt Simu­lation Downloads ProduktserieCVR
(V (DC))
dV/dt
(V/µs)
DF @ 1 kHz
(%)
RISOBetriebstemperaturRaster
(mm)
L
(mm)
W
(mm)
H
(mm)
TiTl
(mm)
PinsZ @ 100 MHz
(Ω)
Zmax
(Ω)
Testbedingung ZmaxIR
(mA)
Z @ 1 GHz
(Ω)
TypReihenG
(mm)
GenderVerpackung Muster