IC-Hersteller NXP

IC-Hersteller (95)

NXP MC33772B | Demoboard RDDRONE-BMS772

Smart Battery Management for Mobile Robotics

Details

TopologieBattery Management System
Eingangsspannung6-26 V
Ausgang 126 V / 90 A
IC-RevisionA

Beschreibung

The 33772 is a SMARTMOS lithium-ion battery cell controller IC designed for automotive applications, such as hybrid electric (HEV) and electric vehicles (EV) along with industrial applications, such as energy storage systems (ESS) and uninterruptible power supply (UPS) systems. The device performs ADC conversions of the differential cell voltages and current, as well as battery coulomb counting and battery temperature measurements. The information is digitally transmitted through the Serial Peripheral Interface (SPI) or Transformer Isolation (TPL) to a microcontroller for processing.

Eigenschaften

  • 5.0 V ≤ VPWR ≤ 30 V operation, 40 V transient
  • 3 to 6 cells management
  • 0.8 mV total cell voltage measurement error
  • Isolated 2.0 Mbps differential communication or 4.0 Mbps SPI
  • Addressable on initialization
  • Synchronized cell voltage/current measurement with coulomb count
  • Total stack voltage measurement
  • Seven GPIO/temperature sensor inputs
  • 5.0 V reference supply output with 5 mA capability
  • Automatic over/undervoltage and temperature detection routable to fault pin
  • Integrated sleep mode over/undervoltage and temperature monitoring
  • Onboard 300 mA passive cell balancing with diagnostics
  • Hot plug capable
  • Detection of internal and external faults, as open lines, shorts, and leakages
  • Designed to support ISO 26262 up to ASIL D safety system
  • Fully compatible with the MC33771 for a maximum of 14 cells
  • Qualified in compliance with AEC-Q100

Typische Anwendungen

  • Uninterruptible Power Supply (UPS)
  • Automotive: 12 V to high-voltage battery packs, E-bikes, e-scooters, Energy Storage Systems (ESS), Battery junction box

Weiterführende Informationen

Artikeldaten

Artikel Nr. Daten­blatt Simu­lation Downloads ProduktserieFarbeλPeak G typ.
(nm)
λDom B typ.
(nm)
λDom G typ.
(nm)
λDom R typ.
(nm)
IV B typ.
(mcd)
IV G typ.
(mcd)
IV R typ.
(mcd)
VF B typ.
(V)
VF G typ.
(V)
VF R typ.
(V)
Chiptechnologie50% typ.
(°)
CTol. CVR
(V (DC))
BauformBetriebstemperaturQ
(%)
DF
(%)
RISOKeramiktypL
(mm)
W
(mm)
Fl
(mm)
L
(µH)
ISAT
(A)
RDC max.
(mΩ)
fres
(MHz)
MontageartPinsReihenH
(mm)
GenderTypIR
(A)
Verpackung Muster
885012005057SPEC
8 Dateien WCAP-CSGP MLCCs 50 V(DC)22 pF ±5% 50 0402 -55 °C up to +125 °C 84010 GΩ NP0 Klasse I 1 0.5 0.25 0.5 7" Tape & Reel
885012205031SPEC
8 Dateien WCAP-CSGP MLCCs 16 V(DC)10 nF ±10% 16 0402 -55 °C up to +125 °C 3.510 GΩ X7R Klasse II 1 0.5 0.25 0.5 7" Tape & Reel
885012205035SPEC
5 Dateien WCAP-CSGP MLCCs 16 V(DC)47 nF ±10% 16 0402 -55 °C up to +125 °C 510 GΩ X7R Klasse II 1 0.5 0.25 0.5 7" Tape & Reel
885012205050SPEC
8 Dateien WCAP-CSGP MLCCs 25 V(DC)10 nF ±10% 25 0402 -55 °C up to +125 °C 3.510 GΩ X7R Klasse II 1 0.5 0.25 0.5 7" Tape & Reel
885012205061SPEC
8 Dateien WCAP-CSGP MLCCs 50 V(DC)1 nF ±10% 50 0402 -55 °C up to +125 °C 2.510 GΩ X7R Klasse II 1 0.5 0.25 0.5 7" Tape & Reel
885012205063SPEC
8 Dateien WCAP-CSGP MLCCs 50 V(DC)2.2 nF ±10% 50 0402 -55 °C up to +125 °C 2.510 GΩ X7R Klasse II 1 0.5 0.25 0.5 7" Tape & Reel
885012205065SPEC
8 Dateien WCAP-CSGP MLCCs 50 V(DC)4.7 nF ±10% 50 0402 -55 °C up to +125 °C 2.510 GΩ X7R Klasse II 1 0.5 0.25 0.5 7" Tape & Reel
885012205067SPEC
8 Dateien WCAP-CSGP MLCCs 50 V(DC)10 nF ±10% 50 0402 -55 °C up to +125 °C 2.510 GΩ X7R Klasse II 1 0.5 0.25 0.5 7" Tape & Reel
62201021121SPEC
6 Dateien WR-PHD 1.27 mm THT Dual Pin Header -40 °C up to +105 °C500 MΩ 6.35 THT 10 Dual Pin Header Gerade 1 Karton
74406043101SPEC
8 Dateien WE-LQFS SMT-Speicherdrossel 4828 -40 °C up to +125 °C 4.8 4.8 100 0.37 600 11 SMT 2.8 0.62
155124M173200SPEC
29 Dateien
WL-SFSW SMT Full-color Side View Waterclear Rot & Grün & Blau 515 465 523 622 140 850 450 3 2.8 2 AlInGaP + InGaN 120 1204 -40 °C up to +85 °C 3.2 1.5 SMT 1 Tape and Reel
Muster
Artikel Nr. Daten­blatt Simu­lation Downloads ProduktserieFarbeλPeak G typ.
(nm)
λDom B typ.
(nm)
λDom G typ.
(nm)
λDom R typ.
(nm)
IV B typ.
(mcd)
IV G typ.
(mcd)
IV R typ.
(mcd)
VF B typ.
(V)
VF G typ.
(V)
VF R typ.
(V)
Chiptechnologie50% typ.
(°)
CTol. CVR
(V (DC))
BauformBetriebstemperaturQ
(%)
DF
(%)
RISOKeramiktypL
(mm)
W
(mm)
Fl
(mm)
L
(µH)
ISAT
(A)
RDC max.
(mΩ)
fres
(MHz)
MontageartPinsReihenH
(mm)
GenderTypIR
(A)
Verpackung Muster