IC-Hersteller Infineon Technologies

IC-Hersteller (96)

Infineon Technologies IMBF170R1K0M1

62.5W Auxiliary Power Supply for Three-phase Power Converter Using the 1700 V CoolSiC™ MOSFET

Details

TopologieSperrwandler
Eingangsspannung200-1000 V
Schaltfrequenz40-130 kHz
Ausgang 124 V / 1 A
Ausgang 215 V / 2 A
Ausgang 3-15 V / 0.5 A
IC-Revision1.0

Beschreibung

The reference board was developed to support customers designing auxiliary power supplies for three-phase converters using the 1700 V CoolSiC™ MOSFET in a single-ended flyback topology. The board has three outputs of +15 V, -15 V and +24 V with up to 62.5 W output power working in a wide input voltage range from 200 VDC to 1000 VDC. The reference board works in quasi-resonant mode and has a peak efficiency of 90.56% at a full load specification.

Eigenschaften

  • Quasi-Resonant Mode Operation
  • Shows the advantages of the 1700 V CoolSiC™ MOSFET technology efficiency performance
  • Current limit, over temperature, overload/open loop protection

Typische Anwendungen

  • Motor control and drives
  • Fast EV charging / Solutions for solar energy systems / Uninterruptible Power Supply (UPS)

Weiterführende Informationen

Artikeldaten

Artikel Nr. Daten­blatt Simu­lation Downloads ProduktseriePinsAnwendungPCB/Kabel/PanelModularityTypWire SectionλDom typ.
(nm)
FarbeλPeak typ.
(nm)
IV typ.
(mcd)
VF typ.
(V)
Chiptechnologie50% typ.
(°)
CVR
(V (DC))
dV/dt
(V/µs)
DF @ 1 kHz
(%)
RISOBetriebstemperaturRaster
(mm)
L
(mm)
W
(mm)
H
(mm)
VerpackungTol. CBauformBetriebstemperaturDF
(%)
KeramiktypFl
(mm)
L
(µH)
IR
(A)
ISAT
(A)
fres
(MHz)
MontageartRDC max.
(mΩ)
Muster
7440520018SPEC
8 Dateien WE-TPC SMT-Speicherdrossel 2 -40 °C up to +125 °C 5.8 5.8 1.8 5818 -40 °C up to +125 °C 1.8 2.6 3 100 SMT 35
691214110002SSPEC
6 Dateien WR-TBL Series 2141S - 3.50 mm Horizontal Entry Modular w. Rising Cage Clamp 2 Rising Cage Clamp PCB Ja Horizontal 30 to 16 (AWG) 0.05 to 1.31 (mm²) -30 °C bis zu +120 °C 3.5 7 Karton -30 °C up to +120 °C 10 THT
691216610002SPEC
6 Dateien WR-TBL Serie 2166 - 10.16 mm Horizontal Entry Rising Cage Clamp 2 Rising Cage Clamp PCB Ja Horizontal 12 to 30 (AWG) 3.31 to 0.0509 (mm²) -30 °C bis zu +120 °C 10.16 15.24 Karton -30 °C up to +120 °C 24 THT
691214110003SSPEC
6 Dateien WR-TBL Series 2141S - 3.50 mm Horizontal Entry Modular w. Rising Cage Clamp 3 Rising Cage Clamp PCB Ja Horizontal 30 to 16 (AWG) 0.05 to 1.31 (mm²) -30 °C bis zu +120 °C 3.5 10.5 Karton -30 °C up to +120 °C 10 THT
744025003SPEC
8 Dateien WE-TPC SMT-Speicherdrossel -40 °C up to +125 °C 2.8 2.8 2.8 2828 -40 °C up to +125 °C 3.3 1.5 1.8 100 SMT 101
744773022SPEC
8 Dateien WE-PD2 SMT-Speicherdrossel -40 °C bis zu +125 °C 4 4.5 3.2 4532 -40 °C up to +125 °C 2.2 2.5 3.38 85 SMT 71
150080RS75000SPEC
7 Dateien WL-SMCW SMT Mono-color Chip LED Waterclear 625 Rot 630 150 2 AlInGaP 140 2 1.25 0.7 Tape and Reel 0805 -40 °C up to +85 °C SMT
885012206053SPEC
8 Dateien WCAP-CSGP MLCCs 25 V(DC)100 pF 2510 GΩ 1.6 0.8 0.8 7" Tape & Reel ±10% 0603 -55 °C up to +125 °C 3.5 X7R Klasse II 0.4
885012206059SPEC
8 Dateien WCAP-CSGP MLCCs 25 V(DC)1 nF 2510 GΩ 1.6 0.8 0.8 7" Tape & Reel ±10% 0603 -55 °C up to +125 °C 3.5 X7R Klasse II 0.4
885012206065SPEC
8 Dateien WCAP-CSGP MLCCs 25 V(DC)10 nF 2510 GΩ 1.6 0.8 0.8 7" Tape & Reel ±10% 0603 -55 °C up to +125 °C 3.5 X7R Klasse II 0.4
885012206068SPEC
8 Dateien WCAP-CSGP MLCCs 25 V(DC)33 nF 2510 GΩ 1.6 0.8 0.8 7" Tape & Reel ±10% 0603 -55 °C up to +125 °C 3.5 X7R Klasse II 0.4
885012206095SPEC
8 Dateien WCAP-CSGP MLCCs 50 V(DC)100 nF 505 GΩ 1.6 0.8 0.8 7" Tape & Reel ±10% 0603 -55 °C up to +125 °C 3 X7R Klasse II 0.4
885012207103SPEC
8 Dateien WCAP-CSGP MLCCs 50 V(DC)1 µF 500.1 GΩ 2 1.25 1.25 7" Tape & Reel ±10% 0805 -55 °C up to +125 °C 10 X7R Klasse II 0.5
890493425009CSSPEC
8 Dateien WCAP-FTBE Folienkondensatoren100 nF 1000 44 19000 MΩ -40 °C bis zu +85 °C 15 18 8.5 15 Karton ±10% Pitch 15 mm
750344264SPEC
Flyback Transformer
Muster
Artikel Nr. Daten­blatt Simu­lation Downloads ProduktseriePinsAnwendungPCB/Kabel/PanelModularityTypWire SectionλDom typ.
(nm)
FarbeλPeak typ.
(nm)
IV typ.
(mcd)
VF typ.
(V)
Chiptechnologie50% typ.
(°)
CVR
(V (DC))
dV/dt
(V/µs)
DF @ 1 kHz
(%)
RISOBetriebstemperaturRaster
(mm)
L
(mm)
W
(mm)
H
(mm)
VerpackungTol. CBauformBetriebstemperaturDF
(%)
KeramiktypFl
(mm)
L
(µH)
IR
(A)
ISAT
(A)
fres
(MHz)
MontageartRDC max.
(mΩ)
Muster