IC-Hersteller GaN Systems

IC-Hersteller (95)

GaN Systems GS66508B / GS66516B / SN6505B | Demoboard GSP665x-EVBIMS2

High Power IMS 2 Evaluation Platform

Details

TopologieGegentaktwandler (Halbbrücken)
Schaltfrequenz10000 kHz
IC-Revision210917

Beschreibung

This horizontal Insulated Metal Substrate (IMS) evaluation platform can be used to evaluate the electrical and thermal performance benefits of GaNPX® bottom-side cooled E-HEMTs in high power applications.The optimized thermal and electrical designs provide a excellent reference for implementing a low cost, high performance design.

Eigenschaften

  • Enhanced thermal and mechanical design
  • Ultra low inductance, bottom-cooled GaNPX® package
  • Minimizing parasitic elements of the power and gate drive loops via magnetic flux-cancellation
  • High performance switching with low EMI
  • Scalable and parallelable GaNPX® packaging for applications up to 100 kW
  • Low cost thermal solution for high power applications.

Typische Anwendungen

  • AC-DC Converters, DC-DC Converters, Bridgeless Totem Pole PFC, Inverters, Industrial Motor Drives, Laser Drivers, Wireless,Power Transfer
  • Appliances
  • Energy Storage Systems, Solar EOn Board Battery Chargers energy
  • Uninterruptible Power Supplies

Weiterführende Informationen

Artikeldaten

Artikel Nr. Daten­blatt Simu­lation Downloads ProduktserieCTol. CVR
(V (DC))
BauformBetriebstemperaturDF
(%)
RISOKeramiktypL
(mm)
W
(mm)
H
(mm)
Fl
(mm)
VerpackungVinVOut1
(V (DC))
IOut1
(A)
Isolierungstypfswitch
(kHz)
∫Udt
(Vµs)
NPRI : NSECL
(µH)
VT
(V (AC))
Montageart Muster
885012206020SPEC
8 Dateien WCAP-CSGP MLCCs 10 V(DC)100 nF ±10% 10 0603 -55 °C up to +125 °C 55 GΩ X7R Klasse II 1.6 0.8 0.8 0.4 7" Tape & Reel
760390014SPEC
7 Dateien WE-PPTI Push-Pull Transformers 1006 -40 °C up to +125 °C 6.73 10.2 4.19 Tape and Reel 5 V (DC) 5 0.6 Functional 300 - 620 11 1:1.3 475 2500 SMT
Artikel Nr. Daten­blatt Simu­lation
885012206020SPEC
760390014SPEC
Muster
Artikel Nr. Daten­blatt Simu­lation Downloads ProduktserieCTol. CVR
(V (DC))
BauformBetriebstemperaturDF
(%)
RISOKeramiktypL
(mm)
W
(mm)
H
(mm)
Fl
(mm)
VerpackungVinVOut1
(V (DC))
IOut1
(A)
Isolierungstypfswitch
(kHz)
∫Udt
(Vµs)
NPRI : NSECL
(µH)
VT
(V (AC))
Montageart Muster