IC-Hersteller AnDAPT Inc

IC-Hersteller (96)

AnDAPT Inc AMP8DSQF65 | Demoboard AnD8300EB

Details

TopologieAbwärtswandler
IC-Revision1.0

Beschreibung

The AmP™ device is an FPGA based platform for creating a custom Power Management Integrated Circuit (PMIC). The AmP device is customized by adding available Power Components designs based on system requirements. AmP device customization is as easy as using WebAmp™ application software to produce a customized PMIC in a very short period of time. AmP devices can be used to power FPGAs, Processors, Microcontrollers, and ASICs by integrating multiple power rails into single chip designs. The AmP device input voltage range is 4.5V to 20V. The AmP device is targeted for wall-powered applications or 2S-4S Li-Ion battery packs. AmP devices have up to 4 additional integrated LDOs of which two are fixed output voltages (3.3V and 1.2V) and two are user programmable.

Eigenschaften

  • Enables On-Demand power management
  • Integrate application targeted Power Components
  • Power Blocks for a variety of topologies
    • Scalable Integrated N-channel MOSFETs (SIM)
    • Current sense for protection, telemetry, regulation
    • Build Switching topologies - Buck, Boost, Buck-Boost
    • Build Linear topologies - LDO, Load Switch
    • Build Mixed topologies - Battery Charger
    • Build BLDC (Motor Control) topologies – H-Bridge
  • Sensor Blocks, sensing voltages and currents
    • Regulation, protection and telemetry
    • Adaptive Digitizer (ADi)
    • Threshold Comparators (ThC)
    • Summation Amplifier (SuM)
    • Noise-Immune Reference (Nref) Array
  • Analog fabric connectivity for sensor signals
  • Digital μLogic fabric connectivity: Analog/Digital Blocks
    • Analog and Digital GPIOs, LUTs for logic & Interface
    • Integrated Compensator RAM (CRAM)
    • On-demand POL control loops and interfaces
    • Precision Modulation Timer Array
  • Industry first: Analog Proficiency – Digital Flexibility

Typische Anwendungen

  • Power Component Integrator / Digital power management IC / Battery Charger

Weiterführende Informationen

Artikeldaten

Artikel Nr. Daten­blatt Simu­lation Downloads ProduktserieλDom typ.
(nm)
FarbeλPeak typ.
(nm)
IV typ.
(mcd)
VF typ.
(V)
Chiptechnologie50% typ.
(°)
MontageartIR 1
(A)
Arbeitsspannung
(V (DC))
CTol. CVR
(V (DC))
BauformBetriebstemperaturDF
(%)
RISOKeramiktypL
(mm)
W
(mm)
Fl
(mm)
L
(µH)
IRP,40K
(A)
ISAT1
(A)
ISAT,30%
(A)
RDC
(mΩ)
fres
(MHz)
MaterialEndurance
(h)
BetriebstemperaturIRIPPLE
(mA)
Z
(mΩ)
ILeak
(µA)
Ø D
(mm)
PinsReihenH
(mm)
GenderTypIR
(A)
Verpackung Muster
150060GS75000SPEC
25 Dateien WL-SMCW SMT Mono-color Chip LED Waterclear 525 Grün 515 430 3.2 InGaN 140 SMT 0603 -40 °C up to +85 °C 1.6 0.8 -40 °C up to +85 °C 0.7 Tape and Reel
150060RS75000SPEC
25 Dateien WL-SMCW SMT Mono-color Chip LED Waterclear 625 Rot 630 250 2 AlInGaP 140 SMT 0603 -40 °C up to +85 °C 1.6 0.8 -40 °C up to +85 °C 0.7 Tape and Reel
744316100SPEC
8 Dateien WE-HCI SMT-Hochstrominduktivität SMT 11.5 5040 -40 °C up to +150 °C 5.5 5.3 1 14.8 5.5 11.5 4.75 158 Superflux -40 °C bis zu +150 °C 2 4 11.5
865080553014SPEC
8 Dateien WCAP-ASLI Aluminium-Elektrolytkondensatoren V-Chip SMT220 µF ±20% 35 8.0 x 10.5 -55 °C up to +105 °C 140.454545 MΩ 10.5 8.3 2000 -55 °C bis zu +105 °C 570 210 77 8 15" Tape & Reel
885012206095SPEC
8 Dateien WCAP-CSGP MLCCs 50 V(DC)100 nF ±10% 50 0603 -55 °C up to +125 °C 35 GΩ X7R Klasse II 1.6 0.8 0.4 0.8 7" Tape & Reel
885012207098SPEC
8 Dateien WCAP-CSGP MLCCs 50 V(DC)100 nF ±10% 50 0805 -55 °C up to +125 °C 2.55 GΩ X7R Klasse II 2 1.25 0.5 0.8 7" Tape & Reel
694108106102SPEC
6 Dateien WR-DC DC Power Jack Right Angled SMT Ø 6.4 with 4 soldering pads & pegs SMT 5 24 -40 °C up to +85 °C100 MΩ -40 °C bis zu +85 °C Right Angled 5 Tape and Reel
61300311121SPEC
6 Dateien WR-PHD 2.54 mm THT Pin Header THT 250 -40 °C up to +105 °C1000 MΩ 7.62 3 Single Pin Header Gerade 3 Beutel
61300421121SPEC
6 Dateien WR-PHD 2.54 mm THT Dual Pin Header THT 250 -40 °C up to +105 °C1000 MΩ 5.08 4 Dual Pin Header Gerade 3 Beutel
Muster
Artikel Nr. Daten­blatt Simu­lation Downloads ProduktserieλDom typ.
(nm)
FarbeλPeak typ.
(nm)
IV typ.
(mcd)
VF typ.
(V)
Chiptechnologie50% typ.
(°)
MontageartIR 1
(A)
Arbeitsspannung
(V (DC))
CTol. CVR
(V (DC))
BauformBetriebstemperaturDF
(%)
RISOKeramiktypL
(mm)
W
(mm)
Fl
(mm)
L
(µH)
IRP,40K
(A)
ISAT1
(A)
ISAT,30%
(A)
RDC
(mΩ)
fres
(MHz)
MaterialEndurance
(h)
BetriebstemperaturIRIPPLE
(mA)
Z
(mΩ)
ILeak
(µA)
Ø D
(mm)
PinsReihenH
(mm)
GenderTypIR
(A)
Verpackung Muster