IC-Hersteller AnDAPT Inc

IC-Hersteller (96)

AnDAPT Inc AMP8DB6QF65 | Demoboard AMP8DB3

Adaptive Multi-Rail Power Platform – AmP

Details

TopologieAbwärtswandler
Eingangsspannung4.75-20 V
Ausgang 13.3 V
IC-Revision2.0

Beschreibung

The AmP™ device is an FPGA based platform for creating a custom Power Management Integrated Circuit (PMIC). The AmP device is customized by adding available Power Components designs based on system requirements. AmP device customization is as easy as using WebAmp™ application software to produce a customized PMIC in a very short period of time. AmP devices can be used to power FPGAs, Processors, Microcontrollers, and ASICs by integrating multiple power rails into single chip designs. The AmP device input voltage range is 4.75V to 20V. The AmP device is targeted for wall-powered applications or 2S-4S Li-Ion battery packs. AmP devices have up to 4 additional integrated LDOs of which two are fixed output voltages (3.3V and 1.2V) and two are user programmable.

Eigenschaften

  • Enables On-Demand power management
  • Integrate application targeted Power Components
  • Power Blocks for a variety of topologies o Scalable Integrated N-channel MOSFETs (SIM) o Current sense for protection, telemetry, regulation o Build Switching topologies - Buck, Boost, Buck-Boost o Build Linear topologies - LDO, Load Switch o Build Mixed topologies - Battery Charger o Build BLDC (Motor Control) topologies – H-Bridge
  • Sensor Blocks, sensing voltages and currents o Regulation, protection and telemetry o Adaptive Digitizer (ADi) o Threshold Comparators (ThC) o Summation Amplifier (SuM) o Noise-Immune Reference (Nref) Array
  • Analog fabric connectivity for sensor signals
  • Digital µLogic fabric connectivity: Analog/Digital Blocks o Analog and Digital GPIOs, LUTs for logic & Interface o Integrated Compensator RAM (CRAM) o On-demand POL control loops and interfaces o Precision Modulation Timer Array
  • Industry first: Analog Proficiency–Digital Flexibility

Typische Anwendungen

  • Build Buck,Boost,Buck-Boost POL topologies, PWM – CV/CC,voltage mode or current mode, Hysteretic – CON/COF, Load Switch, LDO - Source/Drain,DDR LDO, External Switching Controllers/Gate Drivers, Peak efficiency > 92%, Soft start/stop.

Weiterführende Informationen

Artikeldaten

Artikel Nr. Daten­blatt Simu­lation Downloads ProduktserieλDom typ.
(nm)
FarbeλPeak typ.
(nm)
IV typ.
(mcd)
VF typ.
(V)
Chiptechnologie50% typ.
(°)
fTol. fStabilität
(ppm)
Cload
(pF)
BetriebstemperaturCVR
(V (DC))
Endurance
(h)
IRIPPLE
(mA)
RESR
(Ω)
ILeak
(µA)
DF
(%)
L
(mm)
W
(mm)
Tol. CBauformRISOKeramiktypFl
(mm)
L
(µH)
IRP,40K
(A)
ISAT,30%
(A)
RDC typ.
(mΩ)
fres
(MHz)
V
(V)
MontageartISAT1
(A)
RDC
(mΩ)
MaterialLR
(µH)
BetriebstemperaturZ
(mΩ)
Ø D
(mm)
PinsReihenH
(mm)
GenderTypIR
(A)
Verpackung Muster
150060GS75000SPEC
25 Dateien WL-SMCW SMT Mono-color Chip LED Waterclear 525 Grün 515 430 3.2 InGaN 140 -40 °C up to +85 °C 1.6 0.8 0603 SMT -40 °C up to +85 °C 0.7 Tape and Reel
150060RS75000SPEC
25 Dateien WL-SMCW SMT Mono-color Chip LED Waterclear 625 Rot 630 250 2 AlInGaP 140 -40 °C up to +85 °C 1.6 0.8 0603 SMT -40 °C up to +85 °C 0.7 Tape and Reel
744311220SPEC
8 Dateien WE-HCI SMT-Hochstrominduktivität -40 °C up to +150 °C 7 6.9 7040 2.2 10.2 13 52 SMT 5.6 11.4 Superflux 1.75 -40 °C bis zu +150 °C 2 3.8
744314110SPEC
8 Dateien WE-HCI SMT-Hochstrominduktivität -40 °C up to +150 °C 7 6.9 7050 1.1 19.6 13 135 SMT 6 3.15 Superflux 0.78 -40 °C bis zu +150 °C 2 4.8
744301025SPEC
8 Dateien WE-HCM SMT-Hochstrominduktivität -40 °C up to +125 °C 11.3 11 1190 0.25 56 64.7 54.4 0.32 MnZn 0.25 8.9 38
865080553014SPEC
8 Dateien WCAP-ASLI Aluminium-Elektrolytkondensatoren -55 °C up to +105 °C220 µF 35 2000 570 0.131909 77 14 10.5 8.3 ±20% 8.0 x 10.50.454545 MΩ V-Chip SMT -55 °C bis zu +105 °C 210 8 15" Tape & Reel
885012206095SPEC
8 Dateien WCAP-CSGP MLCCs 50 V(DC) -55 °C up to +125 °C100 nF 50 3 1.6 0.8 ±10% 06035 GΩ X7R Klasse II 0.4 0.8 7" Tape & Reel
885012107006SPEC
8 Dateien WCAP-CSGP MLCCs 6.3 V(DC) -55 °C up to +85 °C47 µF 6.3 10 2 1.25 ±20% 08050.002 GΩ X5R Klasse II 0.5 1.25 7" Tape & Reel
885012107014SPEC
8 Dateien WCAP-CSGP MLCCs 16 V(DC) -55 °C up to +85 °C10 µF 16 10 2 1.25 ±20% 08050.01 GΩ X5R Klasse II 0.5 1.25 7" Tape & Reel
61300311121SPEC
6 Dateien WR-PHD 2.54 mm THT Pin Header -40 °C up to +105 °C 7.621000 MΩ THT 3 Single Pin Header Gerade 3 Beutel
61300421121SPEC
6 Dateien WR-PHD 2.54 mm THT Dual Pin Header -40 °C up to +105 °C 5.081000 MΩ THT 4 Dual Pin Header Gerade 3 Beutel
74438357010SPEC
9 Dateien WE-MAPI SMT-Speicherdrossel -40 °C up to +125 °C 4 4 4030 1 10.25 12.5 11.6 59 80 SMT 6.2 2 3.1 7.4
875046319001SPEC
8 Dateien WCAP-PHSE Aluminium-Polymer-Kondensatoren -55 °C up to +105 °C470 µF 2.5 2000 10200 0.003 117.5 6 7.3 4.3 ±20% 7.3 x 4.3 x 1.9 H-Chip SMT 1.9 13" Tape & Reel
830070868SPEC
5 Dateien WE-XTAL Schwingquarz12 MHz ±10ppm 20 18 -40 °C up to +85 °C 3.2 2.5 CFPX-180 0.8
Muster
Artikel Nr. Daten­blatt Simu­lation Downloads ProduktserieλDom typ.
(nm)
FarbeλPeak typ.
(nm)
IV typ.
(mcd)
VF typ.
(V)
Chiptechnologie50% typ.
(°)
fTol. fStabilität
(ppm)
Cload
(pF)
BetriebstemperaturCVR
(V (DC))
Endurance
(h)
IRIPPLE
(mA)
RESR
(Ω)
ILeak
(µA)
DF
(%)
L
(mm)
W
(mm)
Tol. CBauformRISOKeramiktypFl
(mm)
L
(µH)
IRP,40K
(A)
ISAT,30%
(A)
RDC typ.
(mΩ)
fres
(MHz)
V
(V)
MontageartISAT1
(A)
RDC
(mΩ)
MaterialLR
(µH)
BetriebstemperaturZ
(mΩ)
Ø D
(mm)
PinsReihenH
(mm)
GenderTypIR
(A)
Verpackung Muster