Wurth Elektronik - Power Modules (MagI³C Series) - Step Down Converter - Variable Output Voltage - MagI³C-VDMM <Hr> <TABLE BORDER=0 CELLSPACING=0 CELLPADDING=0> <TR> <TD BGCOLOR="#cccccc" ALIGN=CENTER>        </TD> <TD BGCOLOR="#cccccc" ALIGN=CENTER> ----- ----- ----- ----- ----- </TD> <TD BGCOLOR="#cccccc" ALIGN=CENTER> --------------------------- WE --------------------------- Würth Elektronik </TD> <TD BGCOLOR="#cccccc" ALIGN=CENTER> ---------O--- ----O-------- ---------O--- ----O-------- ---------O--- </TD> <TD BGCOLOR="#cccccc" ALIGN=CENTER>        </TD> </TR> <TR> <TD COLSPAN=7>  </TD> </TR> </TABLE>                                        More than you expect <HR> Würth Elektronik eiSos GmbH & Co. KG EMC & Inductive Solutions Max-Eyth-Str.1 D-74638 Waldenburg Tel: +49 (0)7942-945-0 Fax:+49 (0)7942-945-5000 <a href="http://www.we-online.com/web/en/electronic_components/produkte_pb/bauteilebibliotheken/eagle_4.php">www.we-online.com/eagle</a> <a href="mailto:libraries@we-online.com">libraries@we-online.com</a> <HR> Disclaimer: While Würth Elektronik eiSos has made every reasonable effort to ensure the accuracy of the PCB layout models provided, Würth Elektronik eiSos does not guarantee the exemption of error on the PCB layout models, nor does Würth Elektronik eiSos guarantee that the PCB layout model is current. Würth Elektronik eiSos reserves the right to make any adjustments at any time without notice. Würth Elektronik eiSos expressly disclaims all implied warranties regarding this PCB layout model. Please contact us for more information. <HR> Eagle Version 9, Library Revision 2026a, 2026-05-12 <HR> Copyright: Würth Elektronik MagI³C-VDMM Variable Step Down MicroModule Size: LGA-9, SMT, 9pins LXWXH=3.5X3.5X1.5mm >NAME >VALUE >NAME >VALUE NOTE: Place the GND pad of the input capacitor as close as possible to pins C2 and C3. Connect it with short and wide traces directly to C2 and C3. NOTE: Place the GND pad of the input capacitor as close as possible to pins C2 and C3. Connect it with short and wide traces directly to C2 and C3. >NAME >VALUE MagI³C-VDMM Variable Step Down MicroModule >NAME >VALUE MagI³C-VDMM Variable Step Down MicroModule >NAME >VALUE MagI³C-VDMM Variable Step Down MicroModule >NAME >VALUE MagI³C-VDMM Variable Step Down MicroModule Size: LGA-9, SMT, 9pins LXWXH=3.5X3.5X1.5mm MagI³C-VDMM Variable Step Down MicroModule MagI³C-VDMM Variable Step Down MicroModule MagI³C-VDMM Variable Step Down MicroModule >NAME >VALUE EN VIN VOUT EP DNC FB DNC DNC DNC DNC GND >NAME VOUT PG FB VIN EN GND >VALUE >NAME VOUT MODE FB VIN EN PGND >VALUE PGND >NAME >VALUE PG EN/SS VIN VOUT FB EP PGND >NAME >VALUE VOUT GND VIN VCC MODE/SYNC FSW VOUT GND EN/UVLO GND GND FB >NAME VOUT PG FB VIN EN PGND >VALUE PGND MagI³C-VDMM Variable Step Down MicroModule Characteristics Low conducted and radiated EMI (compliant to EN55022 class B / CISPR-22 LGA-6EP Very low profile micropackage Ideal for space constrained applications 3 solder cycles supported LGA-8EP Very low profile micropackage Ideal for space constrained applications For direct connection to 24 V industrial voltage network 3 solder cycles supported LGA-12 Very low profile micro package Ideal for space constrained applications For direct connection to 48 V industrial voltage network Spread spectrum for optimized EMI performance 2 solder cycles supported Applications Point-of-Load DC/DC applications Replacement for linear regulators Interface and microcontroller supply DSP and FPGA power supply auxiliary voltages Portable instruments Battery powered equipment Sensors <a href="https://www.we-online.com/components/media/o109063v209%20VDMM_Group.jpg" title="Enlarge picture"> <img src="https://www.we-online.com/components/media/o109063v209%20VDMM_Group.jpg" width="320"></a> Details see: <a href="www.we-online.com/catalog/MAGIC-VDMM/?utm_source=eagle_model&utm_medium=description_link&utm_campaign=eisos_eagle">www.we-online.com/en/components/products/MAGIC-VDMM</a> Created By Ella Wu 2025-08-01 2025 (C) Würth Elektronik MagI³C-VDMM Variable Step Down MicroModule Characteristics Low conducted and radiated EMI (compliant to EN55022 class B / CISPR-22 LGA-6EP Very low profile micropackage Ideal for space constrained applications 3 solder cycles supported LGA-8EP Very low profile micropackage Ideal for space constrained applications For direct connection to 24 V industrial voltage network 3 solder cycles supported Applications Point-of-Load DC/DC applications Replacement for linear regulators Interface and microcontroller supply DSP and FPGA power supply auxiliary voltages Portable instruments Battery powered equipment Sensors <a href="https://www.we-online.com/components/media/o109063v209%20VDMM_Group.jpg" title="Enlarge picture"> <img src="https://www.we-online.com/components/media/o109063v209%20VDMM_Group.jpg" width="320"></a> Details see: <a href="www.we-online.com/catalog/MAGIC-VDMM/?utm_source=eagle_model&utm_medium=description_link&utm_campaign=eisos_eagle">www.we-online.com/en/components/products/MAGIC-VDMM</a>MagI³C-VDMM Variable Step Down MicroModule Characteristics Low conducted and radiated EMI (compliant to EN55022 class B / CISPR-22 LGA-6EP Very low profile micropackage Ideal for space constrained applications 3 solder cycles supported LGA-8EP Very low profile micropackage Ideal for space constrained applications For direct connection to 24 V industrial voltage network 3 solder cycles supported LGA-12 Very low profile micro package Ideal for space constrained applications For direct connection to 48 V industrial voltage network Spread spectrum for optimized EMI performance 2 solder cycles supported Applications Point-of-Load DC/DC applications Replacement for linear regulators Interface and microcontroller supply DSP and FPGA power supply auxiliary voltages Portable instruments Battery powered equipment Sensors <a href="https://www.we-online.com/components/media/o109063v209%20VDMM_Group.jpg" title="Enlarge picture"> <img src="https://www.we-online.com/components/media/o109063v209%20VDMM_Group.jpg" width="320"></a> Details see: <a href="www.we-online.com/catalog/MAGIC-VDMM/?utm_source=eagle_model&utm_medium=description_link&utm_campaign=eisos_eagle">www.we-online.com/en/components/products/MAGIC-VDMM</a> Created By Ella Wu 2024-09-09 2024 (C) Würth Elektronik MagI³C-VDMM Variable Step Down MicroModule Characteristics Low conducted and radiated EMI (compliant to EN55022 class B / CISPR-22 LGA-6EP Very low profile micropackage Ideal for space constrained applications 3 solder cycles supported LGA-8EP Very low profile micropackage Ideal for space constrained applications For direct connection to 24 V industrial voltage network 3 solder cycles supported LGA-12 Very low profile micro package Ideal for space constrained applications For direct connection to 48 V industrial voltage network Spread spectrum for optimized EMI performance 2 solder cycles supported Applications Point-of-Load DC/DC applications Replacement for linear regulators Interface and microcontroller supply DSP and FPGA power supply auxiliary voltages Portable instruments Battery powered equipment Sensors <a href="https://www.we-online.com/components/media/o109063v209%20VDMM_Group.jpg" title="Enlarge picture"> <img src="https://www.we-online.com/components/media/o109063v209%20VDMM_Group.jpg" width="320"></a> Details see: <a href="www.we-online.com/catalog/MAGIC-VDMM/?utm_source=eagle_model&utm_medium=description_link&utm_campaign=eisos_eagle">www.we-online.com/en/components/products/MAGIC-VDMM</a> Created By Ella Wu 2026-05-08 2026 (C) Würth Elektronik MagI³C-VDMM Variable Step Down MicroModule Characteristics Low conducted and radiated EMI (compliant to EN55022 class B / CISPR-22 LGA-6EP Very low profile micropackage Ideal for space constrained applications 3 solder cycles supported LGA-8EP Very low profile micropackage Ideal for space constrained applications For direct connection to 24 V industrial voltage network 3 solder cycles supported LGA-12 Very low profile micro package Ideal for space constrained applications For direct connection to 48 V industrial voltage network Spread spectrum for optimized EMI performance 2 solder cycles supported Applications Point-of-Load DC/DC applications Replacement for linear regulators Interface and microcontroller supply DSP and FPGA power supply auxiliary voltages Portable instruments Battery powered equipment Sensors <a href="https://www.we-online.com/components/media/o109063v209%20VDMM_Group.jpg" title="Enlarge picture"> <img src="https://www.we-online.com/components/media/o109063v209%20VDMM_Group.jpg" width="320"></a> Details see: <a href="www.we-online.com/catalog/MAGIC-VDMM/?utm_source=eagle_model&utm_medium=description_link&utm_campaign=eisos_eagle">www.we-online.com/en/components/products/MAGIC-VDMM</a> Created By Ella Wu 2025-08-01 2025 (C) Würth Elektronik MagI³C-VDMM Variable Step Down MicroModule Characteristics Low conducted and radiated EMI (compliant to EN55022 class B / CISPR-22 LGA-6EP Very low profile micropackage Ideal for space constrained applications 3 solder cycles supported LGA-8EP Very low profile micropackage Ideal for space constrained applications For direct connection to 24 V industrial voltage network 3 solder cycles supported LGA-12 Very low profile micro package Ideal for space constrained applications For direct connection to 48 V industrial voltage network Spread spectrum for optimized EMI performance 2 solder cycles supported Applications Point-of-Load DC/DC applications Replacement for linear regulators Interface and microcontroller supply DSP and FPGA power supply auxiliary voltages Portable instruments Battery powered equipment Sensors <a href="https://www.we-online.com/components/media/o109063v209%20VDMM_Group.jpg" title="Enlarge picture"> <img src="https://www.we-online.com/components/media/o109063v209%20VDMM_Group.jpg" width="320"></a> Details see: <a href="www.we-online.com/catalog/MAGIC-VDMM/?utm_source=eagle_model&utm_medium=description_link&utm_campaign=eisos_eagle">www.we-online.com/en/components/products/MAGIC-VDMM</a> Created By Ella Wu 2025-08-01 2025 (C) Würth Elektronik MagI³C-VDMM Variable Step Down MicroModule Characteristics Low conducted and radiated EMI (compliant to EN55022 class B / CISPR-22 LGA-6EP Very low profile micropackage Ideal for space constrained applications 3 solder cycles supported LGA-8EP Very low profile micropackage Ideal for space constrained applications For direct connection to 24 V industrial voltage network 3 solder cycles supported Applications Point-of-Load DC/DC applications Replacement for linear regulators Interface and microcontroller supply DSP and FPGA power supply auxiliary voltages Portable instruments Battery powered equipment Sensors <a href="https://www.we-online.com/components/media/o109063v209%20VDMM_Group.jpg" title="Enlarge picture"> <img src="https://www.we-online.com/components/media/o109063v209%20VDMM_Group.jpg" width="320"></a> Details see: <a href="www.we-online.com/catalog/MAGIC-VDMM/?utm_source=eagle_model&utm_medium=description_link&utm_campaign=eisos_eagle">www.we-online.com/en/components/products/MAGIC-VDMM</a>MagI³C-VDMM Variable Step Down MicroModule Characteristics Low conducted and radiated EMI (compliant to EN55022 class B / CISPR-22 LGA-6EP Very low profile micropackage Ideal for space constrained applications 3 solder cycles supported LGA-8EP Very low profile micropackage Ideal for space constrained applications For direct connection to 24 V industrial voltage network 3 solder cycles supported LGA-12 Very low profile micro package Ideal for space constrained applications For direct connection to 48 V industrial voltage network Spread spectrum for optimized EMI performance 2 solder cycles supported Applications Point-of-Load DC/DC applications Replacement for linear regulators Interface and microcontroller supply DSP and FPGA power supply auxiliary voltages Portable instruments Battery powered equipment Sensors <a href="https://www.we-online.com/components/media/o109063v209%20VDMM_Group.jpg" title="Enlarge picture"> <img src="https://www.we-online.com/components/media/o109063v209%20VDMM_Group.jpg" width="320"></a> Details see: <a href="www.we-online.com/catalog/MAGIC-VDMM/?utm_source=eagle_model&utm_medium=description_link&utm_campaign=eisos_eagle">www.we-online.com/en/components/products/MAGIC-VDMM</a> Updated By Ella Wu 2019-09-18 2019 (C) Würth Elektronik MagI³C-VDMM Variable Step Down MicroModule Characteristics Low conducted and radiated EMI (compliant to EN55022 class B / CISPR-22 LGA-6EP Very low profile micropackage Ideal for space constrained applications 3 solder cycles supported LGA-8EP Very low profile micropackage Ideal for space constrained applications For direct connection to 24 V industrial voltage network 3 solder cycles supported Applications Point-of-Load DC/DC applications Replacement for linear regulators Interface and microcontroller supply DSP and FPGA power supply auxiliary voltages Portable instruments Battery powered equipment Sensors <a href="https://www.we-online.com/components/media/o109063v209%20VDMM_Group.jpg" title="Enlarge picture"> <img src="https://www.we-online.com/components/media/o109063v209%20VDMM_Group.jpg" width="320"></a> Details see: <a href="www.we-online.com/catalog/MAGIC-VDMM/?utm_source=eagle_model&utm_medium=description_link&utm_campaign=eisos_eagle">www.we-online.com/en/components/products/MAGIC-VDMM</a>MagI³C-VDMM Variable Step Down MicroModule Characteristics Low conducted and radiated EMI (compliant to EN55022 class B / CISPR-22 LGA-6EP Very low profile micropackage Ideal for space constrained applications 3 solder cycles supported LGA-8EP Very low profile micropackage Ideal for space constrained applications For direct connection to 24 V industrial voltage network 3 solder cycles supported LGA-12 Very low profile micro package Ideal for space constrained applications For direct connection to 48 V industrial voltage network Spread spectrum for optimized EMI performance 2 solder cycles supported Applications Point-of-Load DC/DC applications Replacement for linear regulators Interface and microcontroller supply DSP and FPGA power supply auxiliary voltages Portable instruments Battery powered equipment Sensors <a href="https://www.we-online.com/components/media/o109063v209%20VDMM_Group.jpg" title="Enlarge picture"> <img src="https://www.we-online.com/components/media/o109063v209%20VDMM_Group.jpg" width="320"></a> Details see: <a href="www.we-online.com/catalog/MAGIC-VDMM/?utm_source=eagle_model&utm_medium=description_link&utm_campaign=eisos_eagle">www.we-online.com/en/components/products/MAGIC-VDMM</a> Updated By Ella Wu 2019-09-18 2019 (C) Würth Elektronik MagI³C-VDMM Variable Step Down MicroModule Characteristics Low conducted and radiated EMI (compliant to EN55022 class B / CISPR-22 LGA-6EP Very low profile micropackage Ideal for space constrained applications 3 solder cycles supported LGA-8EP Very low profile micropackage Ideal for space constrained applications For direct connection to 24 V industrial voltage network 3 solder cycles supported Applications Point-of-Load DC/DC applications Replacement for linear regulators Interface and microcontroller supply DSP and FPGA power supply auxiliary voltages Portable instruments Battery powered equipment Sensors <a href="https://www.we-online.com/components/media/o109063v209%20VDMM_Group.jpg" title="Enlarge picture"> <img src="https://www.we-online.com/components/media/o109063v209%20VDMM_Group.jpg" width="320"></a> Details see: <a href="www.we-online.com/catalog/MAGIC-VDMM/?utm_source=eagle_model&utm_medium=description_link&utm_campaign=eisos_eagle">www.we-online.com/en/components/products/MAGIC-VDMM</a>MagI³C-VDMM Variable Step Down MicroModule Characteristics Low conducted and radiated EMI (compliant to EN55022 class B / CISPR-22 LGA-6EP Very low profile micropackage Ideal for space constrained applications 3 solder cycles supported LGA-8EP Very low profile micropackage Ideal for space constrained applications For direct connection to 24 V industrial voltage network 3 solder cycles supported LGA-12 Very low profile micro package Ideal for space constrained applications For direct connection to 48 V industrial voltage network Spread spectrum for optimized EMI performance 2 solder cycles supported Applications Point-of-Load DC/DC applications Replacement for linear regulators Interface and microcontroller supply DSP and FPGA power supply auxiliary voltages Portable instruments Battery powered equipment Sensors <a href="https://www.we-online.com/components/media/o109063v209%20VDMM_Group.jpg" title="Enlarge picture"> <img src="https://www.we-online.com/components/media/o109063v209%20VDMM_Group.jpg" width="320"></a> Details see: <a href="www.we-online.com/catalog/MAGIC-VDMM/?utm_source=eagle_model&utm_medium=description_link&utm_campaign=eisos_eagle">www.we-online.com/en/components/products/MAGIC-VDMM</a> Updated By Ella Wu 2019-09-18 2019 (C) Würth Elektronik MagI³C-VDMM Variable Step Down MicroModule Characteristics Low conducted and radiated EMI (compliant to EN55022 class B / CISPR-22 LGA-6EP Very low profile micropackage Ideal for space constrained applications 3 solder cycles supported LGA-8EP Very low profile micropackage Ideal for space constrained applications For direct connection to 24 V industrial voltage network 3 solder cycles supported LGA-12 Very low profile micro package Ideal for space constrained applications For direct connection to 48 V industrial voltage network Spread spectrum for optimized EMI performance 2 solder cycles supported Applications Point-of-Load DC/DC applications Replacement for linear regulators Interface and microcontroller supply DSP and FPGA power supply auxiliary voltages Portable instruments Battery powered equipment Sensors <a href="https://www.we-online.com/components/media/o109063v209%20VDMM_Group.jpg" title="Enlarge picture"> <img src="https://www.we-online.com/components/media/o109063v209%20VDMM_Group.jpg" width="320"></a> Details see: <a href="www.we-online.com/catalog/MAGIC-VDMM/?utm_source=eagle_model&utm_medium=description_link&utm_campaign=eisos_eagle">www.we-online.com/en/components/products/MAGIC-VDMM</a> Created By Ella Wu 2020-04-28 2020 (C) Würth Elektronik MagI³C-VDMM Variable Step Down MicroModule Characteristics Low conducted and radiated EMI (compliant to EN55022 class B / CISPR-22 LGA-6EP Very low profile micropackage Ideal for space constrained applications 3 solder cycles supported LGA-8EP Very low profile micropackage Ideal for space constrained applications For direct connection to 24 V industrial voltage network 3 solder cycles supported Applications Point-of-Load DC/DC applications Replacement for linear regulators Interface and microcontroller supply DSP and FPGA power supply auxiliary voltages Portable instruments Battery powered equipment Sensors <a href="https://www.we-online.com/components/media/o109063v209%20VDMM_Group.jpg" title="Enlarge picture"> <img src="https://www.we-online.com/components/media/o109063v209%20VDMM_Group.jpg" width="320"></a> Details see: <a href="www.we-online.com/catalog/MAGIC-VDMM/?utm_source=eagle_model&utm_medium=description_link&utm_campaign=eisos_eagle">www.we-online.com/en/components/products/MAGIC-VDMM</a>MagI³C-VDMM Variable Step Down MicroModule Characteristics Low conducted and radiated EMI (compliant to EN55022 class B / CISPR-22 LGA-6EP Very low profile micropackage Ideal for space constrained applications 3 solder cycles supported LGA-8EP Very low profile micropackage Ideal for space constrained applications For direct connection to 24 V industrial voltage network 3 solder cycles supported LGA-12 Very low profile micro package Ideal for space constrained applications For direct connection to 48 V industrial voltage network Spread spectrum for optimized EMI performance 2 solder cycles supported Applications Point-of-Load DC/DC applications Replacement for linear regulators Interface and microcontroller supply DSP and FPGA power supply auxiliary voltages Portable instruments Battery powered equipment Sensors <a href="https://www.we-online.com/components/media/o109063v209%20VDMM_Group.jpg" title="Enlarge picture"> <img src="https://www.we-online.com/components/media/o109063v209%20VDMM_Group.jpg" width="320"></a> Details see: <a href="www.we-online.com/catalog/MAGIC-VDMM/?utm_source=eagle_model&utm_medium=description_link&utm_campaign=eisos_eagle">www.we-online.com/en/components/products/MAGIC-VDMM</a> Created By Ella Wu 2021-12-08 2021 (C) Würth Elektronik Since Version 6.2.2 text objects can contain more than one line, which will not be processed correctly with this version. Since Version 8.3, EAGLE supports URNs for individual library assets (packages, symbols, and devices). The URNs of those assets will not be understood (or retained) with this version. Since Version 8.3, EAGLE supports the association of 3D packages with devices in libraries, schematics, and board files. Those 3D packages will not be understood (or retained) with this version.