<BR>Wurth Elektronik - Passive Components - Power Magnetics - Coupled Power Inductors - WE-TDC HV<br>
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<B> More than you expect<BR><BR><BR></B>
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<b>Würth Elektronik eiSos GmbH & Co. KG</b><br>
EMC & Inductive Solutions<br>
Max-Eyth-Str.1<br>
D-74638 Waldenburg<br>
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Tel: +49 (0)7942-945-0<br>
Fax:+49 (0)7942-945-5000<br>
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<a href="http://www.we-online.com/web/en/electronic_components/produkte_pb/bauteilebibliotheken/eagle_4.php">www.we-online.com/eagle</a><br>
<a href="mailto:libraries@we-online.com">libraries@we-online.com</a> <BR><BR>
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Disclaimer: While Würth Elektronik eiSos has made every reasonable effort to ensure the accuracy of the PCB layout models provided, <br>
Würth Elektronik eiSos does not guarantee the exemption of error on the PCB layout models, nor does Würth Elektronik eiSos guarantee that the PCB layout model is current. <br>
Würth Elektronik eiSos reserves the right to make any adjustments at any time without notice. <br>
Würth Elektronik eiSos expressly disclaims all implied warranties regarding this PCB layout model. <br>
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Please contact us for more information.<br>
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<br>Eagle Version 9, Library Revision 2026a, 2026-05-13<br>
<HR>
Copyright: Würth Elektronik
<b>WE-TDC HV SMD Coupled Inductor<br>
<br>Size: </b>8018, SMT, 4pins
<br>LXWXH=8X8X3.8mm
>NAME
>VALUE
<b>WE-TDC HV SMD Coupled Inductor<br>
<br>Size: </b>8018, SMT, 4pins
<br>LXWXH=8X8X1.8mm
>NAME
>VALUE
<b>WE-TDC HV SMD Coupled Inductor<br>
<br>Size: </b>8018, SMT, 4pins
<br>LXWXH=8X8X3.8mm
<b>WE-TDC HV SMD Coupled Inductor<br>
<br>Size: </b>8018, SMT, 4pins
<br>LXWXH=8X8X1.8mm
>NAME
>VALUE
<b>WE-TDC HV SMT Coupled Inductor</b><br>
<br>
<b> Characteristics</b><br>
<br>Low profile coupled inductor with 2.0kV Isolation
<br>Low losses and low Leakage Inductance
<br>Magnetical shielded
<br>1:1 Transformer
<br>Operation temperature: -40°C to +125°C
<br>Functional Isolation for a working voltage or 250VRMS
<br>Reference Designs
<br>RD006 3 W Dual-output isolated auxiliary supply for communication interfaces and measurement systems
<br>
<br><b> Applications</b><br>
<br>High density Isolated converter application (e.g. Flyback converter)
<br>Buck, Boost, Sepic, Zeta, CUK Converter
<br>Switching regulator with second unregulated output voltage
<br>
<br>
<br><a href="https://www.we-online.com/components/media/o14862v209%20Family_WE-TDC.jpg" title="Enlarge picture">
<img src="https://www.we-online.com/components/media/o14862v209%20Family_WE-TDC.jpg" width="320"></a><p>
Details see: <a href="www.we-online.com/catalog/WE-TDCHV/?utm_source=eagle_model&utm_medium=description_link&utm_campaign=eisos_eagle">www.we-online.com/en/components/products/WE-TDCHV</a><p>
</b>Updated by Ella 2026-05-13<br>
</b>2026 (C) Würth Elektronik
<b>WE-TDC HV SMT Coupled Inductor</b><br>
<br>
<b> Characteristics</b><br>
<br>Low profile coupled inductor with 2.0kV Isolation
<br>Low losses and low Leakage Inductance
<br>Magnetical shielded
<br>1:1 Transformer
<br>Operation temperature: -40°C to +125°C
<br>Functional Isolation for a working voltage or 250VRMS
<br>Reference Designs
<br>RD006 3 W Dual-output isolated auxiliary supply for communication interfaces and measurement systems
<br>
<br><b> Applications</b><br>
<br>High density Isolated converter application (e.g. Flyback converter)
<br>Buck, Boost, Sepic, Zeta, CUK Converter
<br>Switching regulator with second unregulated output voltage
<br>
<br>
<br><a href="https://www.we-online.com/components/media/o14862v209%20Family_WE-TDC.jpg" title="Enlarge picture">
<img src="https://www.we-online.com/components/media/o14862v209%20Family_WE-TDC.jpg" width="320"></a><p>
Details see: <a href="www.we-online.com/catalog/WE-TDCHV/?utm_source=eagle_model&utm_medium=description_link&utm_campaign=eisos_eagle">www.we-online.com/en/components/products/WE-TDCHV</a><p>
</b>Updated by Ella 2026-05-13<br>
</b>2026 (C) Würth Elektronik
Since Version 8.3, EAGLE supports URNs for individual library
assets (packages, symbols, and devices). The URNs of those assets
will not be understood (or retained) with this version.
Since Version 8.3, EAGLE supports the association of 3D packages
with devices in libraries, schematics, and board files. Those 3D
packages will not be understood (or retained) with this version.