Würth Elektronik - Passive Components - Power Magnetics - Shielded Power Inductors - WE-MXGI Disclaimer: While Würth Elektronik eiSos has made every reasonable effort to ensure the accuracy of the PCB layout models provided, Würth Elektronik eiSos does not guarantee the exemption of error on the PCB layout models, nor does Würth Elektronik eiSos guarantee that the PCB layout model is current. Würth Elektronik eiSos reserves the right to make any adjustments at any time without notice. Würth Elektronik eiSos expressly disclaims all implied warranties regarding this PCB layout model. Please contact us for more information: libraries@we-online.com Würth Elektronik eiSos GmbH & Co. KG EMC & Inductive Solutions www.we-online.com Fusion360, Library Revision 2026a, 2026-07-14 Copyright: Würth Elektronik WE-MXGI SMT Power Inductor Size:5030,SMT,2pins LXWXH=5.4X5.4X3.1mm >NAME >VALUE WE-MXGI SMT Power Inductor Size:4020,SMT,2pins LXWXH=4.1X4.1X2.1mm >NAME >VALUE WE-MXGI SMT Power Inductor Size:4020,SMT,2pins LXWXH=4.1X4.1X2.1mm This Land pattern is based on the IPC-7351 Standard >NAME >VALUE WE-MXGI SMT Power Inductor Size:4030,SMT,2pins LXWXH=4.1X4.1X3.1mm >NAME >VALUE WE-MXGI SMT Power Inductor Size:4030,SMT,2pins LXWXH=4.1X4.1X3.1mm This Land pattern is based on the IPC-7351 Standard >NAME >VALUE WE-MXGI SMT Power Inductor Size:5030,SMT,2pins LXWXH=5.4X5.4X3.1mm WE-MXGI SMT Power Inductor Size:4020,SMT,2pins LXWXH=4.1X4.1X2.1mm WE-MXGI SMT Power Inductor Size:4020,SMT,2pins LXWXH=4.1X4.1X2.1mm This Land pattern is based on the IPC-7351 Standard >NAME >VALUE WE-MXGI SMT Power Inductor Characteristics Innovative iron alloy material Ultra low RDC and AC losses High efficiency and current capability Optimized for high switching frequencies beyond 1 MHz Compact design Magnetically shielded construction Operating temperature: -40 °C to 125°C Applications DC/DC-converter for high current power supplies DC/DC-converter for Field Programmable Gate Array (FPGA) POL-converters Portable power like PDA, digital camera Mainboards/graphic cards Battery powered devices Wireless communication devices Power supplies for smartphones, tablet PCs and other mobile devices High frequency applications (GaN and SiC) Details see: www.we-online.com/en/components/products/WE-MXGI Created by Ella 2024-06-07 2024(C) Würth Elektronik WE-MXGI SMT Power Inductor Characteristics Innovative iron alloy material Ultra low RDC and AC losses High efficiency and current capability Optimized for high switching frequencies beyond 1 MHz Compact design Magnetically shielded construction Operating temperature: -40 °C to 125°C Applications DC/DC-converter for high current power supplies DC/DC-converter for Field Programmable Gate Array (FPGA) POL-converters Portable power like PDA, digital camera Mainboards/graphic cards Battery powered devices Wireless communication devices Power supplies for smartphones, tablet PCs and other mobile devices High frequency applications (GaN and SiC) Details see: www.we-online.com/en/components/products/WE-MXGI Updated by Ella 2024-09-27 2024(C) Würth Elektronik WE-MXGI SMT Power Inductor Characteristics Innovative iron alloy material Ultra low RDC and AC losses High efficiency and current capability Optimized for high switching frequencies beyond 1 MHz Compact design Magnetically shielded construction Operating temperature: -40 °C to 125°C Applications DC/DC-converter for high current power supplies DC/DC-converter for Field Programmable Gate Array (FPGA) POL-converters Portable power like PDA, digital camera Mainboards/graphic cards Battery powered devices Wireless communication devices Power supplies for smartphones, tablet PCs and other mobile devices High frequency applications (GaN and SiC) Details see: www.we-online.com/en/components/products/WE-MXGI Created by Ella 2026-07-14 2026(C) Würth Elektronik Since Version 8.3, EAGLE supports URNs for individual library assets (packages, symbols, and devices). The URNs of those assets will not be understood (or retained) with this version. Since Version 8.3, EAGLE supports the association of 3D packages with devices in libraries, schematics, and board files. Those 3D packages will not be understood (or retained) with this version.