Würth Elektronik - Passive Components - Power Magnetics - Inductors for Multiphase Converters - WE-HCIM Disclaimer: While Würth Elektronik eiSos has made every reasonable effort to ensure the accuracy of the PCB layout models provided, Würth Elektronik eiSos does not guarantee the exemption of error on the PCB layout models, nor does Würth Elektronik eiSos guarantee that the PCB layout model is current. Würth Elektronik eiSos reserves the right to make any adjustments at any time without notice. Würth Elektronik eiSos expressly disclaims all implied warranties regarding this PCB layout model. Please contact us for more information: libraries@we-online.com Würth Elektronik eiSos GmbH & Co. KG EMC & Inductive Solutions www.we-online.com Autodesk Fusion and EAGLE 9.X compatible Library Files Library Revision 2026a, 2026-10-20 Copyright: Würth Elektronik WE-HCIM High-Current Molded Inductor for Multiphase Applications Size: 110407 SMT, 2pins LXWXH=11mmX4mmX7.3mm >NAME >VALUE WE-HCIM High-Current Molded Inductor for Multiphase Applications Size: 100706 SMT, 2pins LXWXH=9.7mmX7mmX5.7mm >NAME >VALUE WE-HCIM High-Current Molded Inductor for Multiphase Applications Size: 100806 SMT, 2pins LXWXH=9.8mmX7.8mmX5.8mm >NAME >VALUE WE-HCIM High-Current Molded Inductor for Multiphase Applications Size: 100605 SMT, 2pins LXWXH=9.8mmX5.8mmX4.8mm >NAME >VALUE WE-HCIM High-Current Molded Inductor for Multiphase Applications Size: 050406 SMT, 2pins LXWXH=4.8mmX3.8mmX5.8mm >NAME >VALUE WE-HCIM High-Current Molded Inductor for Multiphase Applications Size: 070506 SMT, 2pins LXWXH=7.1mmX4.7mmX5.8mm >NAME >VALUE WE-HCIM High-Current Molded Inductor for Multiphase Applications Size: 080506 SMT, 2pins LXWXH=7.8mmX4.8mmX5.8mm >NAME >VALUE WE-HCIM High-Current Molded Inductor for Multiphase Applications Size: 110407 SMT, 2pins LXWXH=11mmX4mmX7.3mm WE-HCIM High-Current Molded Inductor for Multiphase Applications Size: 100706 SMT, 2pins LXWXH=9.7mmX7mmX5.7mm WE-HCIM High-Current Molded Inductor for Multiphase Applications Size: 100806 SMT, 2pins LXWXH=9.8mmX7.8mmX5.8mm WE-HCIM High-Current Molded Inductor for Multiphase Applications Size: 100605 SMT, 2pins LXWXH=9.8mmX5.8mmX4.8mm WE-HCIM High-Current Molded Inductor for Multiphase Applications Size: 050406 SMT, 2pins LXWXH=4.8mmX3.8mmX5.8mm WE-HCIM High-Current Molded Inductor for Multiphase Applications Size: 070506 SMT, 2pins LXWXH=7.1mmX4.7mmX5.8mm WE-HCIM High-Current Molded Inductor for Multiphase Applications Size: 080506 SMT, 2pins LXWXH=7.8mmX4.8mmX5.8mm >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE WE-HCIM High-Current Molded Inductor for Multiphase Applications Characteristics Low inductance: <100 nH Low DC resistance of <0.3 mΩ High saturation current of 67–130 A High-frequency capability: self-resonant frequency up to 300 MHz Core material: iron alloy High efficiency for demanding, high-current applications Flexible design options: suitable for single, double, 2×2 matrix, and TLVR topologies Operating temperature up to 155 °C Applications Multiphase VRM for CPUs/GPUs/AI accelerators Data center servers and high-performance computing (HPC) platforms AI chip Power Delivery Networks (PDN) High Power ASIC applications Laptop/notebook power supplies Power modules for high-end semiconductor/chipset manufacturers 5 G PMUs due to its ability to operate at very high frequencies Details see: www.we-online.com/components/products/WE-HCIM Created by Ella 2026-10-20 2026 (C) Würth Elektronik WE-HCIM High-Current Molded Inductor for Multiphase Applications Characteristics Low inductance: <100 nH Low DC resistance of <0.3 mΩ High saturation current of 67–130 A High-frequency capability: self-resonant frequency up to 300 MHz Core material: iron alloy High efficiency for demanding, high-current applications Flexible design options: suitable for single, double, 2×2 matrix, and TLVR topologies Operating temperature up to 155 °C Applications Multiphase VRM for CPUs/GPUs/AI accelerators Data center servers and high-performance computing (HPC) platforms AI chip Power Delivery Networks (PDN) High Power ASIC applications Laptop/notebook power supplies Power modules for high-end semiconductor/chipset manufacturers 5 G PMUs due to its ability to operate at very high frequencies Details see: www.we-online.com/components/products/WE-HCIM Created by Ella 2026-10-20 2026 (C) Würth Elektronik WE-HCIM High-Current Molded Inductor for Multiphase Applications Characteristics Low inductance: <100 nH Low DC resistance of <0.3 mΩ High saturation current of 67–130 A High-frequency capability: self-resonant frequency up to 300 MHz Core material: iron alloy High efficiency for demanding, high-current applications Flexible design options: suitable for single, double, 2×2 matrix, and TLVR topologies Operating temperature up to 155 °C Applications Multiphase VRM for CPUs/GPUs/AI accelerators Data center servers and high-performance computing (HPC) platforms AI chip Power Delivery Networks (PDN) High Power ASIC applications Laptop/notebook power supplies Power modules for high-end semiconductor/chipset manufacturers 5 G PMUs due to its ability to operate at very high frequencies Details see: www.we-online.com/components/products/WE-HCIM Created by Ella 2026-10-20 2026 (C) Würth Elektronik WE-HCIM High-Current Molded Inductor for Multiphase Applications Characteristics Low inductance: <100 nH Low DC resistance of <0.3 mΩ High saturation current of 67–130 A High-frequency capability: self-resonant frequency up to 300 MHz Core material: iron alloy High efficiency for demanding, high-current applications Flexible design options: suitable for single, double, 2×2 matrix, and TLVR topologies Operating temperature up to 155 °C Applications Multiphase VRM for CPUs/GPUs/AI accelerators Data center servers and high-performance computing (HPC) platforms AI chip Power Delivery Networks (PDN) High Power ASIC applications Laptop/notebook power supplies Power modules for high-end semiconductor/chipset manufacturers 5 G PMUs due to its ability to operate at very high frequencies Details see: www.we-online.com/components/products/WE-HCIM Created by Ella 2026-10-20 2026 (C) Würth Elektronik WE-HCIM High-Current Molded Inductor for Multiphase Applications Characteristics Low inductance: <100 nH Low DC resistance of <0.3 mΩ High saturation current of 67–130 A High-frequency capability: self-resonant frequency up to 300 MHz Core material: iron alloy High efficiency for demanding, high-current applications Flexible design options: suitable for single, double, 2×2 matrix, and TLVR topologies Operating temperature up to 155 °C Applications Multiphase VRM for CPUs/GPUs/AI accelerators Data center servers and high-performance computing (HPC) platforms AI chip Power Delivery Networks (PDN) High Power ASIC applications Laptop/notebook power supplies Power modules for high-end semiconductor/chipset manufacturers 5 G PMUs due to its ability to operate at very high frequencies Details see: www.we-online.com/components/products/WE-HCIM Created by Ella 2026-10-20 2026 (C) Würth Elektronik WE-HCIM High-Current Molded Inductor for Multiphase Applications Characteristics Low inductance: <100 nH Low DC resistance of <0.3 mΩ High saturation current of 67–130 A High-frequency capability: self-resonant frequency up to 300 MHz Core material: iron alloy High efficiency for demanding, high-current applications Flexible design options: suitable for single, double, 2×2 matrix, and TLVR topologies Operating temperature up to 155 °C Applications Multiphase VRM for CPUs/GPUs/AI accelerators Data center servers and high-performance computing (HPC) platforms AI chip Power Delivery Networks (PDN) High Power ASIC applications Laptop/notebook power supplies Power modules for high-end semiconductor/chipset manufacturers 5 G PMUs due to its ability to operate at very high frequencies Details see: www.we-online.com/components/products/WE-HCIM Created by Ella 2026-10-20 2026 (C) Würth Elektronik WE-HCIM High-Current Molded Inductor for Multiphase Applications Characteristics Low inductance: <100 nH Low DC resistance of <0.3 mΩ High saturation current of 67–130 A High-frequency capability: self-resonant frequency up to 300 MHz Core material: iron alloy High efficiency for demanding, high-current applications Flexible design options: suitable for single, double, 2×2 matrix, and TLVR topologies Operating temperature up to 155 °C Applications Multiphase VRM for CPUs/GPUs/AI accelerators Data center servers and high-performance computing (HPC) platforms AI chip Power Delivery Networks (PDN) High Power ASIC applications Laptop/notebook power supplies Power modules for high-end semiconductor/chipset manufacturers 5 G PMUs due to its ability to operate at very high frequencies Details see: www.we-online.com/components/products/WE-HCIM Created by Ella 2026-10-20 2026 (C) Würth Elektronik Since Version 8.3, EAGLE supports URNs for individual library assets (packages, symbols, and devices). The URNs of those assets will not be understood (or retained) with this version. Since Version 8.3, EAGLE supports the association of 3D packages with devices in libraries, schematics, and board files. Those 3D packages will not be understood (or retained) with this version.