Wurth Elektronik - Passive Components - Capacitors - MLCCs-Multilayer Ceramic Chip Capacitors - WCAP-CSGP <Hr> <TABLE BORDER=0 CELLSPACING=0 CELLPADDING=0> <TR> <TD BGCOLOR="#cccccc" ALIGN=CENTER>        </TD> <TD BGCOLOR="#cccccc" ALIGN=CENTER> ----- ----- ----- ----- ----- </TD> <TD BGCOLOR="#cccccc" ALIGN=CENTER> --------------------------- WE --------------------------- Würth Elektronik </TD> <TD BGCOLOR="#cccccc" ALIGN=CENTER> ---------O--- ----O-------- ---------O--- ----O-------- ---------O--- </TD> <TD BGCOLOR="#cccccc" ALIGN=CENTER>        </TD> </TR> <TR> <TD COLSPAN=7>  </TD> </TR> </TABLE>                                        More than you expect <HR> Würth Elektronik eiSos GmbH & Co. KG EMC & Inductive Solutions Max-Eyth-Str.1 D-74638 Waldenburg Tel: +49 (0)7942-945-0 Fax:+49 (0)7942-945-5000 <a href="http://www.we-online.com/web/en/electronic_components/produkte_pb/bauteilebibliotheken/eagle_4.php">www.we-online.com/eagle</a> <a href="mailto:libraries@we-online.com">libraries@we-online.com</a> <HR> Disclaimer: While Würth Elektronik eiSos has made every reasonable effort to ensure the accuracy of the PCB layout models provided, Würth Elektronik eiSos does not guarantee the exemption of error on the PCB layout models, nor does Würth Elektronik eiSos guarantee that the PCB layout model is current. Würth Elektronik eiSos reserves the right to make any adjustments at any time without notice. Würth Elektronik eiSos expressly disclaims all implied warranties regarding this PCB layout model. Please contact us for more information. <HR> Eagle Version 9, Library Revision 2025d, 2025-10-29 <HR> Copyright: Würth Elektronik WCAP-CSGP MLCCs 0201, SMT, 2pins LXWXH=0.6X0.3X0.3mm >NAME >VALUE WCAP-CSGP MLCCs 0402, SMT, 2pins LXWXH=1X0.5X0.5mm >NAME >VALUE WCAP-CSGP MLCCs 1206, SMT, 2pins LXWXH=3.2X1.6X1.6mm >NAME >VALUE WCAP-CSGP MLCCs 0805, SMT, 2pins LXWXH=2x1.25x1.25mm >NAME >VALUE WCAP-CSGP MLCCs 0805, SMT, 2pins LXWXH=2x1.25x0.6mm Solder type: Wave >NAME >VALUE WCAP-CSGP MLCCs 0805, SMT, 2pins LXWXH=2x1.25x0.8mm Solder type: Reflow >NAME >VALUE WCAP-CSGP MLCCs 1210, SMT, 2pins LXWXH=3.2X2.5X2.5mm >NAME >VALUE WCAP-CSGP MLCCs 1210, SMT, 2pins LXWXH=3.2X2.5X1.6mm >NAME >VALUE WCAP-CSGP MLCCs 0805, SMT, 2pins LXWXH=2x1.25x0.6mm Solder type: Reflow >NAME >VALUE WCAP-CSGP MLCCs 1812, SMT, 2pins LXWXH=4.5X3.2X1.25mm >NAME >VALUE WCAP-CSGP MLCCs 0603, SMT, 2pins LXWXH=1.6x0.8 X0.8mm Solder type: Wave >NAME >VALUE WCAP-CSGP MLCCs 0603, SMT, 2pins LXWXH=1.6x0.8 X0.8mm Solder type: Reflow >NAME >VALUE WCAP-CSGP MLCCs 1210, SMT, 2pins LXWXH=3.2X2.5X0.95mm >NAME >VALUE WCAP-CSGP MLCCs 1206, SMT, 2pins LXWXH=3.2X1.6X0.95mm >NAME >VALUE WCAP-CSGP MLCCs 1206, SMT, 2pins LXWXH=3.2X1.6X0.8mm >NAME >VALUE WCAP-CSGP MLCCs 1206, SMT, 2pins LXWXH=3.2X1.6X1.25mm >NAME >VALUE WCAP-CSGP MLCCs 1210, SMT, 2pins LXWXH=3.2X2.5X2.0mm >NAME >VALUE WCAP-CSGP MLCCs 1206, SMT, 2pins LXWXH=3.2X1.6X1.15mm >NAME >VALUE WCAP-CSGP MLCCs 2220, SMT, 2pins LXWXH=5.7X5X2.8mm >NAME >VALUE WCAP-CSGP MLCCs 0805, SMT, 2pins LXWXH=2x1.25x0.8mm Solder type: Wave >NAME >VALUE WCAP-CSGP MLCCs 1210, SMT, 2pins LXWXH=3.2X2.5X1.25mm >NAME >VALUE WCAP-CSGP MLCCs 1812, SMT, 2pins LXWXH=4.5X3.2X2.5mm >NAME >VALUE WCAP-CSGP MLCCs 2220, SMT, 2pins LXWXH=5.7X5X2.0mm >NAME >VALUE WCAP-CSGP MLCCs 1812, SMT, 2pins LXWXH=4.5X3.2X2.0mm >NAME >VALUE WCAP-CSGP MLCCs 2220, SMT, 2pins LXWXH=5.7X5X2.5mm >NAME >VALUE WCAP-CSGP MLCCs 0201, SMT, 2pins LXWXH=0.6X0.3X0.3mm WCAP-CSGP MLCCs 0402, SMT, 2pins LXWXH=1X0.5X0.5mm WCAP-CSGP MLCCs 1206, SMT, 2pins LXWXH=3.2X1.6X1.6mm WCAP-CSGP MLCCs 0805, SMT, 2pins LXWXH=2x1.25x1.25mm WCAP-CSGP MLCCs 0805, SMT, 2pins LXWXH=2x1.25x0.6mm Solder type: Wave WCAP-CSGP MLCCs 0805, SMT, 2pins LXWXH=2x1.25x0.8mm Solder type: Reflow WCAP-CSGP MLCCs 1210, SMT, 2pins LXWXH=3.2X2.5X2.5mm WCAP-CSGP MLCCs 1210, SMT, 2pins LXWXH=3.2X2.5X1.6mm WCAP-CSGP MLCCs 1812, SMT, 2pins LXWXH=4.5X3.2X1.25mm WCAP-CSGP MLCCs 0603, SMT, 2pins LXWXH=1.6x0.8 X0.8mm Solder type: Reflow WCAP-CSGP MLCCs 0805, SMT, 2pins LXWXH=2x1.25x0.6mm Solder type: Reflow WCAP-CSGP MLCCs 1210, SMT, 2pins LXWXH=3.2X2.5X0.95mm WCAP-CSGP MLCCs 0603, SMT, 2pins LXWXH=1.6x0.8 X0.8mm Solder type: Wave WCAP-CSGP MLCCs 1206, SMT, 2pins LXWXH=3.2X1.6X0.95mm WCAP-CSGP MLCCs 1206, SMT, 2pins LXWXH=3.2X1.6X0.8mm WCAP-CSGP MLCCs 1210, SMT, 2pins LXWXH=3.2X2.5X2.0mm WCAP-CSGP MLCCs 1206, SMT, 2pins LXWXH=3.2X1.6X1.25mm WCAP-CSGP MLCCs 2220, SMT, 2pins LXWXH=5.7X5X2.8mm WCAP-CSGP MLCCs 1206, SMT, 2pins LXWXH=3.2X1.6X1.15mm WCAP-CSGP MLCCs 0805, SMT, 2pins LXWXH=2x1.25x0.8mm Solder type: Wave WCAP-CSGP MLCCs 1210, SMT, 2pins LXWXH=3.2X2.5X1.25mm WCAP-CSGP MLCCs 1812, SMT, 2pins LXWXH=4.5X3.2X2.5mm WCAP-CSGP MLCCs 1812, SMT, 2pins LXWXH=4.5X3.2X2.0mm WCAP-CSGP MLCCs 2220, SMT, 2pins LXWXH=5.7X5X2.0mm WCAP-CSGP MLCCs 2220, SMT, 2pins LXWXH=5.7X5X2.5mm >NAME >VALUE WCAP-CSGP MLCCs 6.3 V(DC) General Purpose Characteristics General purpose product series Ceramic: X5R (Class II), X7R (Class II) Temperature coefficient: ±15 % for X5R and X7R Termination: Cu/Ni/Sn Applications Temperature compensation (NP0) Coupling Decoupling Bypass Smoothing Filtering Resonant circuit <a href="https://www.we-online.com/components/media/o177837v209 MLCC_GRP_all.jpg" title="Enlarge picture"> <img src="https://www.we-online.com/components/media/o177837v209 MLCC_GRP_all.jpg" width="320"></a> Details see: <a href="www.we-online.com/catalog/WCAP-CSGP-6_3VDC/?utm_source=eagle_model&utm_medium=description_link&utm_campaign=eisos_eagle">www.we-online.com/en/components/products/WCAP-CSGP-6_3VDC</a> Updated by Ella Wu 2025-04-23 2025 (C) Würth Elektronik WCAP-CSGP MLCCs 10 V(DC) General Purpose Characteristics General purpose product series High performance ceramic High electrical precision and stability ceramic especially for NP0 Ceramic: NP0 (Class I), X5R (Class II), X7R (Class II) Temperature Coefficient: ±30 ppm/°C; ±0.54 % for NP0 ±15 % for X5R and X7R Termination: Cu/Ni/Sn Applications Temperature compensation (NP0) Coupling Decoupling Bypass Smoothing Filtering Resonant circuit <a href="https://www.we-online.com/components/media/o177837v209%20MLCC_GRP_all.jpg" title="Enlarge picture"> <img src="https://www.we-online.com/components/media/o177837v209%20MLCC_GRP_all.jpg" width="320"></a> Details see: <a href="www.we-online.com/catalog/WCAP-CSGP-10VDC/?utm_source=eagle_model&utm_medium=description_link&utm_campaign=eisos_eagle">www.we-online.com/en/components/products/WCAP-CSGP-10VDC</a> Updated by Ella Wu 2025-09-09 2025 (C) Würth Elektronik WCAP-CSGP MLCCs 25 V(DC) General Purpose Characteristics General purpose product series High performance ceramic High electrical precision and stability ceramic especially for NP0 Ceramic: NP0 (Class I), X5R (Class II), X7R (Class II) Temperature coefficient: ±30 ppm/°C; ±0.54 % for NP0 ±15 % for X5R and X7R Termination: Cu/Ni/Sn Applications Temperature compensation (NP0) Coupling Decoupling Bypass Smoothing Filtering Resonant circuit <a href="https://www.we-online.com/components/media/o177837v209%20MLCC_GRP_all.jpg" title="Enlarge picture"> <img src="https://www.we-online.com/components/media/o177837v209%20MLCC_GRP_all.jpg" width="320"></a> Details see: <a href="www.we-online.com/catalog/WCAP-CSGP-25VDC/?utm_source=eagle_model&utm_medium=description_link&utm_campaign=eisos_eagle">www.we-online.com/en/components/products/WCAP-CSGP-25VDC</a> Updated by Ella Wu 2025-04-23 2025 (C) Würth Elektronik WCAP-CSGP MLCCs 16 V(DC) General Purpose Characteristics General purpose product series High performance ceramic High electrical precision and stability ceramic especially for NP0 Ceramic: NP0 (Class I), X5R (Class II), X7R (Class II) Temperature coefficient: ±30 ppm/°C; ±0.54 % for NP0 ±15 % for X5R and X7R Termination: Cu/Ni/Sn Applications Temperature compensation (NP0) Coupling Decoupling Bypass Smoothing Filtering Resonant circuit <a href="https://www.we-online.com/components/media/o177837v209%20MLCC_GRP_all.jpg" title="Enlarge picture"> <img src="https://www.we-online.com/components/media/o177837v209%20MLCC_GRP_all.jpg" width="320"></a> Details see: <a href="www.we-online.com/catalog/WCAP-CSGP-16VDC/?utm_source=eagle_model&utm_medium=description_link&utm_campaign=eisos_eagle">www.we-online.com/en/components/products/WCAP-CSGP-16VDC</a> Updated by Ella Wu 2025-06-12 2025 (C) Würth Elektronik WCAP-CSGP MLCCs 50 V(DC) General Purpose Characteristics General purpose product series High performance ceramic High electrical precision and stability ceramic especially for NP0 Ceramic: NP0 (Class I), X5R (Class II), X7R (Class II) Temperature coefficient: ±30 ppm/°C; ±0.54 % for NP0 ±15 % for X5R and X7R Termination: Cu/Ni/Sn Applications Temperature compensation (NP0) Coupling Decoupling Bypass Smoothing Filtering Resonant circuit <a href="https://www.we-online.com/components/media/o177837v209%20MLCC_GRP_all.jpg" title="Enlarge picture"> <img src="https://www.we-online.com/components/media/o177837v209%20MLCC_GRP_all.jpg" width="320"></a> Details see: <a href="www.we-online.com/catalog/WCAP-CSGP-50VDC/?utm_source=eagle_model&utm_medium=description_link&utm_campaign=eisos_eagle">www.we-online.com/en/components/products/WCAP-CSGP-50VDC</a> Updated by Ella Wu 2025-04-23 2025 (C) Würth Elektronik WCAP-CSGP MLCCs 100 V(DC) General Purpose Characteristics General purpose product series High performance ceramic High electrical precision and stability ceramic especially for NP0 Ceramic: NP0 (Class I), X7R (Class II) Temperature coefficient: ±30 ppm/°C; ±0.54 % for NP0 ±15 % for X7R Termination: Cu/Ni/Sn Applications Temperature compensation (NP0) Coupling Decoupling Bypass Smoothing Filtering Resonant circuit <a href="https://www.we-online.com/components/media/o177838v209 MLCC_GRP_without 1812.jpg" title="Enlarge picture"> <img src="https://www.we-online.com/components/media/o177838v209 MLCC_GRP_without 1812.jpg" width="320"></a> Details see: <a href="www.we-online.com/catalog/WCAP-CSGP-100VDC/?utm_source=eagle_model&utm_medium=description_link&utm_campaign=eisos_eagle">www.we-online.com/en/components/products/WCAP-CSGP-100VDC</a> Updated by Ella Wu 2025-10-29 2025 (C) Würth Elektronik Since Version 8.3, EAGLE supports URNs for individual library assets (packages, symbols, and devices). The URNs of those assets will not be understood (or retained) with this version. Since Version 8.3, EAGLE supports the association of 3D packages with devices in libraries, schematics, and board files. Those 3D packages will not be understood (or retained) with this version.