<BR>Wurth Elektronik - Signal & Communications - RF Inductors - WE-RFH<br><Hr>
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<B><I><span style='font-size:26pt;
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---------------------------<BR><b>Würth Elektronik</b></FONT>
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<B> More than you expect<BR><BR><BR></B>
<HR><BR>
<b>Würth Elektronik eiSos GmbH & Co. KG</b><br>
EMC & Inductive Solutions<br>
Max-Eyth-Str.1<br>
D-74638 Waldenburg<br>
<br>
Tel: +49 (0)7942-945-0<br>
Fax:+49 (0)7942-945-5000<br>
<br>
<a href="http://www.we-online.com/web/en/electronic_components/produkte_pb/bauteilebibliotheken/eagle_4.php">www.we-online.com/eagle</a><br>
<a href="mailto:libraries@we-online.com">libraries@we-online.com</a> <BR><BR>
<br><HR><BR>
Neither Autodesk nor Würth Elektronik eiSos does warrant that this library is error-free or <br>
that it meets your specific requirements.<br><BR>
Please contact us for more information.<br>
<HR>
<br>Eagle Version 9, Library Revision 2019a, 2019-09-26<br>
<HR>
Copyright: Würth Elektronik
<b>WE-RFH Ferrite SMD Inductor
</b><br>Szie : 1008A
>NAME
>VALUE
<b>WE-RFH Ferrite SMD Inductor
</b><br>Szie : 1008A
>NAME
>VALUE
<b> WE-RFH Ferrite SMD Inductor
<br>
<br><b> Characteristics
<br>
<br></b></b>High thermal stability
<br>Recommended solder profile: Reflow
<br>Operating temperature: –40 ºC to +85 ºC
<br>High inductances
<br>High currents
<br>
<br><b> Applications
<br>
<br></b>Developed especially for RF applications
<br>Perfect for telecommunication applications
<br>
<br>
<br><a href="https://katalog.we-online.com/media/images/v2/o14842v209%20Family_WE-RFH.jpg" title="Enlarge picture">
<img src="https://katalog.we-online.com/media/images/v2/o14842v209%20Family_WE-RFH.jpg" width="320"></a><p>
Details see: <a href="https://katalog.we-online.com/en/pbs/WE-RFH">https://katalog.we-online.com/en/pbs/WE-RFH</a><p>
Updated by Ella Wu 2019-08-20<br>
2019 (C) Wurth Elektronik
Since Version 8.3, EAGLE supports URNs for individual library
assets (packages, symbols, and devices). The URNs of those assets
will not be understood (or retained) with this version.
Since Version 8.3, EAGLE supports the association of 3D packages
with devices in libraries, schematics, and board files. Those 3D
packages will not be understood (or retained) with this version.