Wirelaid 3D Design Rules

The following Design Rules apply to the flat wire type:

  • F 14: 1,4 x 0,35 mm2 / Cross-section area Ø 0,49 mm2
Wirelaid Design Rules for flat wire type F 14
  Dimensions (Minimum) F 14 (350 x 1400 μm2)
LB Track width above wire 1.9 mm
A1 Distance of pitch between wires of separate potentials (considering the positioning of the pad) 1.9 mm + Iso distance*
A2 Distance of pitch between wires of same potentials 1.8 mm
Smax Max. length of wire between welding points 100 mm
Smin Min. length of wire between welding points 7.5 mm
IL Isolation distance between wire and inner layer Dependent on the specific stack-up of the customer, which we are pleased to create for you.
*Dependent on the thickness of copper layer according to the current Basic Design Guide of Würth Elektronik.
Wirelaid 3D Design Rules for flat wire type F 14
  Dimensions (Minimum)  
C Distance copper to milled edge 0.3 mm
F Width of milled slot F = 0,4 x (thickness of PCB – R) + 200 μm
K Solder mask clearance in bending area 1.0 mm
R Thickness of residual material Thickness of wire + copper + solder mask + 150 μm

  • Wires need to be arranged at right angles to the bending area
  • The usage of an applicable bending (forming) tool is recommended
  • Bending radius ≥ 0.1 mm
  • Care has to be taken so that the bent parts are secured in the installed application to avoid further movement