Thermal simulation of the printed circuit board

Already during the predevelopment phase of printed circuit boards, the PCB designer is faced with numerous questions. Thermal simulation of the printed circuit board can help to select the best printed circuit board construction and the optimal layout.

Thermal simulation can support the design of an optimal printed circuit board at relatively low expense. The following simulation presents the results of different versions for heat dissipation of an LED with 3 watt dissipation loss.

Summary:

Versions 1 and 2 do not provide sufficient heat dissipation.

Version 3 is borderline. If it is taken into account that the LED itself also generates a temperature of 4 to 6 degrees, the permitted junction temperatures could already be exceeded.

The use of thermal vias and a heat sink in Version 4 can guarantee reliable heat dissipation of the LED.