NEW: The Design Guide for Flex-Rigid PCBs and the Design Guide Poster!
Flex or semiflex? Polyimid film or FR-4? Flexible layer inside or outside? With cover layer or without? You’ll find answers to all this in the new Design Guide for Flex-Rigid PCBs. Here our experts have summarised the most important parameters and best design tips for you. With this guide you can be sure of reliable results for your application.
The standard Design Rules for 3D technology summarise all the important key parameters you need to make your project a success and to apply this dependable technology.
- Flex material: polyimide 50µm
- material: FR4 cores, FR4 prepreg
- Adhesive: acrylic adhesive or epoxy no-flow
Covering the flex area
- 1F/2F/4F: flexible solder-stop foil
- 1F-xRi: flexible solder-mask (partial)
- xRi-2F-xRi: cover layer (polyimide/adhesive)
Generally, all IPC-2223A Class A (flex-to-install) designs are possible. Request the current Design Rules here!
Applications which go beyond our standard Design Rules require technical clarification with our product management. We would be pleased to help you in delivery panel design for rigid-flex solutions. Send us an e-mail with your question to email@example.com for a rapid response.