Individual solutions for the control of technical systems 

For a long time, the design of these component groups was characterised by complicated solder connections and complex wire harnesses. Today, these applications can be produced in a significantly more compact way, with a high level of process reliability and more cost-effectiveness through intelligent integration of ICS press-fit technology. 

And here we provide you with economical complete solutions from a single source: From the press-fit component, through to the circuit board, up to the packaging solution, along with you, we develop fast and flexible solutions for your special needs. 

Advantages at a glance 

• ICS press-fit technology allows double-sided component assembly of the substrate PCBs; this solution saves space and significantly enhances the cost-effectiveness of the component group  
• Selective and hybrid component assembly possible  
• The technologies of pressing, reflow and wave soldering can be combined   
• Integrated connector for power supply   
• Impedance monitored circuit boards   
• Automatic component assembly  
• Precise monitoring of the press-fit forces (force-displacement monitoring)  
• 100% electrical testing  

Over 20 years of accumulated know-how in the field of customer-specific backplanes makes us a strong partner for you! Challenge us!