Why Microvia Technology? 

HDI (high density interconnection) circuit boards and Microvia Technology are inextricably linked. 

Microvias are minute holes drilled by a laser to generate the electrical connection between the layers in a multilayer circuit board. 

This technology offers many advantages: 

• Option of component layout with the smallest BGA pitch  
• Miniaturisation with ‘Via in Pad’ technology  
• Cost-effective generation of high wiring density  
• Future-proof technology – components are becoming smaller all the time  
• High reliability  
• Reduction in inductance and capacitance effects